Source-Down Semiconductor Connector Layout to Prevent Chip-Edge Shorts
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving low electrical resistance and easy assembly while avoiding short circuits, particularly in configurations where the source electrode is located on the lower surface (source-down structure) due to potential contact with the semiconductor chip edges.
Innovation Solution
The semiconductor device design includes a connector configuration with specific length ratios and orientations, ensuring the source electrode is on the lower surface, and the connector is structured to minimize contact with the chip edges, allowing for easy assembly and reduced electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the source electrode is located on the lower surface (source-down structure), then the electrical resistance is reduced, but the risk of short circuit with semiconductor chip edges increases
Solution Approach 1:
An insulating structure is introduced as an intermediary between the source electrode and the semiconductor chip edges. This insulating structure prevents direct contact that would cause short circuits, while allowing the source-down configuration to maintain low electrical resistance. The insulating structure acts as a mediator that resolves the conflict between electrical performance and safety.
2Reliability
If the connector is configured with specific length ratios to prevent short circuits, then reliability is improved, but the assembly complexity increases
Solution Approach 1:
The insulating structure is merged with the connector assembly, integrating the short-circuit prevention function into the existing connector structure. This combination reduces the need for separate insulating components and simplifies the overall assembly process, while still maintaining the necessary geometric constraints for reliable operation.
3Ease of operation
If the connector has extended portions for easy assembly, then the ease of operation is improved, but the device complexity increases
Solution Approach 1:
The connector is segmented into distinct functional portions: a first portion for electrical connection, a second portion for positioning, and a third exposed portion for assembly operations. This segmentation allows each portion to be optimized for its specific function, with the third portion providing extended accessibility for easy assembly while the other portions maintain compact dimensions for reliable electrical connection.
Data Source
AI summary
A first conductor includes a first portion, a second portion, and a third portion. The first portion is in contact with the first electrode and has a second length in the first direction that is shorter than the first length. The second portion is located farther in a second direction than the first portion, is connected to the first portion, and has a third length in the first direction that is longer than the second length. The third portion is located farther in the second direction than the second portion, is connected to the second portion, and is exposed from a sealing resin.