Speaker Diaphragm Insulation via Resin Flow in Through Hole
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Solution Overview
Problem
Existing speaker diaphragm manufacturing techniques face challenges in securing insulation and rigidity when a hole is made for a tinsel wire, often requiring additional components and compromising the diaphragm's structural integrity.
Innovation Solution
A method involving a conductive layer with a through hole, where resin layers are interposed between the conductive layer and pressed using molds with protruding punches to ensure insulation and rigidity, with the resin flowing into the gap to envelop the conductive layer, thereby securing both insulation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a through hole is made in the speaker diaphragm for tinsel wire insertion, then electrical connection is enabled, but insulation cannot be secured and rigidity becomes insufficient
Solution Approach 1:
A resin layer is introduced as an intermediary material between the conductive layer and the through hole, filling the hole and providing electrical insulation. This allows the tinsel wire to pass through while maintaining insulation, resolving the contradiction between ease of wire insertion and reliability of insulation.
Solution Approach 2:
The resin layer is nested within the through hole, with the conductive layer positioned between resin layers. The resin material is inserted into the hole space, creating a nested structure that provides insulation while maintaining the through-hole functionality for wire insertion.
2Reliability
If a separate component is added to secure insulation, then insulation is achieved, but the hole size must be larger and rigidity becomes insufficient
Solution Approach 1:
The insulation function is merged with the existing resin layers that are already part of the speaker diaphragm structure. Instead of adding a separate insulation component, the same resin material serves both as structural layer and insulation medium, eliminating the need for larger holes and maintaining rigidity.
Solution Approach 2:
The resin layer serves multiple functions simultaneously: it provides structural support for the diaphragm, maintains rigidity, and provides electrical insulation around the through hole. This multi-functionality eliminates the need for separate insulation components and larger holes.
3Weight of moving object
If the conductive layer is made thinner to reduce weight, then weight is reduced, but insulation capability deteriorates
Solution Approach 1:
The insulation function is segmented from the conductive layer by introducing a dedicated resin layer. The conductive layer can be made thin for weight reduction, while the resin layer provides the insulation capability, separating the two functions into distinct layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively secures insulation and enhances the rigidity of the speaker diaphragm while allowing the tinsel wire to pass through, without the need for additional components, ensuring reliable electrical isolation and mechanical stability.
Implementation Method 1
pressing, by the closing, the resin layers on an inside of the through hole with respect to a laminated body in which the resin layers are respectively arranged on both surfaces of the conductive layer
Implementation Method 2
pressurizing a space formed by joining of the recesses of the mold in the second step, in which in the third step, the resin layers are pressurized and fused together on an inside of the through hole
Data Source
AI summary
A method of manufacturing a speaker diaphragm having a conductive layer and resin layers arranged to interpose the conductive layer is provided. The method includes: a first step of providing a through hole for causing a tinsel wire to pass through a conductive layer; and a second step of closing a mold, in which a punch having a diameter smaller than a diameter of the through hole is provided in each of first and second molds, to cause the punches to press the resin layers on an inside of the through hole with respect to a laminated body in which the resin layers are arranged on both surfaces of the conductive layer. In the second step, leaked material of the resin layers flows in an inner side surface direction of the through hole by pressing into a gap portion near outer surfaces of the punches.