Spectrum Chip Assembly Using Separate Modulation and Sensing Units
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Solution Overview
Problem
The manufacturing process of spectrum chips is limited by fab constraints and prone to contamination, which hinders high-performance production and mass production, especially due to high temperature requirements and the presence of logic circuits that can pollute the production line.
Innovation Solution
The process of forming a light modulation structure is transferred to a substrate, allowing the modulation unit to be formed separately and coupled to the sensing unit without logic circuits, thereby avoiding fab limitations and contamination, and optimizing the light modulation layer material selection for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light modulation structure is formed on the spectrum chip substrate in the existing manufacturing process, then the spectrum chip can be produced, but the process is limited by fab constraints and prone to contamination from logic circuits
Solution Approach 1:
The patent divides the spectrum chip into two separate components: a modulation unit (containing only the light modulation structure on a substrate) and a sensing unit (containing the sensor and logic circuits). By forming the light modulation structure separately on a substrate without logic circuits, the contamination risk from metal powders is eliminated, while still achieving the complete spectrum chip functionality through coupling the two units.
Solution Approach 2:
The patent extracts the light modulation structure from the sensing unit and places it on a separate substrate to form an independent modulation unit. This extraction removes the harmful logic circuits from the manufacturing process environment, eliminating the source of contamination while preserving the essential light modulation function needed for spectrum analysis.
2Manufacturing precision
If high temperature processing is used in the manufacturing process, then the light modulation structure can be formed, but it causes damage to the spectrum chip and performance degradation
Solution Approach 1:
The patent forms the light modulation structure on a substrate separately before coupling it to the sensing unit. This preliminary formation allows the use of appropriate processing temperatures suitable for the substrate and modulation materials without exposing the temperature-sensitive sensing unit to high temperatures, thereby avoiding performance degradation while still achieving precise light modulation structure formation.
3Productivity
If the spectrum chip is produced using existing fab-limited processes, then mass production can be achieved, but the logic circuits pollute the production line
Solution Approach 1:
The patent segments the spectrum chip production into two independent units: a modulation unit produced without logic circuits and a sensing unit containing the logic circuits. This segmentation allows the modulation unit to be manufactured in a clean environment free from metal powder contamination, while the sensing unit can be produced using existing fab processes, thereby enabling mass production without contamination.
Solution Approach 2:
The patent extracts the logic circuits from the light modulation structure formation process by placing them only in the sensing unit. This extraction eliminates the source of metal powder contamination from the production line while preserving the ability to mass produce spectrum chips through separate coupling of the clean modulation unit and the fab-produced sensing unit.
Data Source
AI summary
The present application provides a spectrum chip and a method for manufacturing it, and a spectrum analysis device. The method for manufacturing the spectrum chip includes: forming at least one light modulation structure on a substrate to obtain a modulation unit; and coupling the modulation unit to a sensing unit, so that the modulation unit is held on a photosensitive path of the sensing unit to obtain the spectrum chip. In this way, the process of forming the light modulation structure is transferred to be performed on the substrate, so as to get rid of the limitation of the existing manufacturing process of the spectrum chip limited by a fab on the one hand, and on the other hand to ensure that the a manufacturing site will not be polluted during the manufacturing process.