Spectrum-Inspection Device Using Multi-Band Filter Array

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Solution Overview

Problem

Conventional spectrum meters are large, heavy, and expensive due to numerous optical elements, and are limited to measuring linear spectra, restricting their applications.

Innovation Solution

A spectrum-inspection device with a multi-band pass filter, filter array, and sensing layer, where the filter array is made using semiconductor manufacturing processes, allowing for a compact design and enabling the measurement of 2D spectra by filtering specific wavelength bands and improving image resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional spectrum meters use multiple optical elements (beam splitters, collimators, focusing mirrors), then measurement function is achieved, but device size and weight increase

Engineering Contradiction:
Improvemeasurement functionVSAvoiddevice weight
Core Design Contradiction:
ReliabilityVSWeight of stationary object

Solution Approach 1:

The patent combines multiple optical elements (beam splitter, collimator, focusing mirror, and detector) into a single integrated optical module. This merging eliminates the need for separate components and their associated mounting structures, directly reducing device weight while maintaining the complete measurement function.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated optical module performs multiple functions simultaneously: beam splitting, collimation, focusing, and detection. This multi-functionality allows a single compact component to replace what would traditionally require multiple separate elements, reducing overall device weight.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If conventional spectrum meters use multiple optical elements (beam splitters, collimators, focusing mirrors), then measurement function is achieved, but device complexity increases

Engineering Contradiction:
Improvemeasurement functionVSAvoidoptical element quantity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates multiple optical elements into a single optical module, reducing the number of discrete components from four or more separate elements to one unified structure. This merging directly decreases device complexity by eliminating the need for multiple alignment and mounting procedures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The optical module is designed as an integrated unit that can be treated as a single functional segment. This segmentation approach simplifies the overall system architecture by creating a self-contained module that performs multiple functions, reducing the complexity of system-level integration.

Inventive Principle:
Principle #1Segmentation

3Measurement precision

If conventional spectrum meters use linear sensors, then linear spectrum measurement is achieved, but application versatility is restricted

Engineering Contradiction:
Improvespectrum measurement capabilityVSAvoidapplication range
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent employs a two-dimensional detector array instead of a linear sensor, enabling the device to capture both linear and area spectra. This multi-functional detection capability allows the same device to perform various measurement tasks including traditional linear spectrum analysis and new applications such as spatially-resolved spectroscopy and imaging spectroscopy.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent transitions from a one-dimensional linear sensor to a two-dimensional detector array. This dimensional expansion adds spatial information to the spectral measurements, enabling area spectrum measurement and significantly expanding the device's application versatility while maintaining linear spectrum measurement capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Weight of stationary object

If semiconductor manufacturing process is used for filter array and sensing layer, then device size is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedevice weightVSAvoidfabrication accuracy
Core Design Contradiction:
Weight of stationary objectVSManufacturing precision

Solution Approach 1:

The patent replaces traditional mechanical or manual assembly processes with semiconductor manufacturing techniques for fabricating the filter array and sensing layer. This substitution enables precise control of layer thickness, filter positioning, and sensor alignment through standardized semiconductor fabrication processes, meeting the high precision requirements while enabling compact device design.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes semiconductor manufacturing parameters (such as thin film deposition thickness, photolithography patterns, and ion implantation depths) to precisely control the optical and electrical properties of the filter array and sensing layer. By optimizing these manufacturing parameters, the device achieves both compact size and high fabrication accuracy.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device achieves a reduction in size and weight, enables 2D spectrum measurement, and enhances the resolution of spectrum images without the need for many optical elements.

Implementation Method 1

The multi-band pass filter allows a first waveband, a second waveband, and a third waveband of a light beam to pass through

Methodology Applied
Scientific EffectOptical filtering: Filter (optical)

Implementation Method 2

The filter array includes a first filter allowing wavelengths of the multi-band beam longer than a first wavelength to pass through, a second filter allowing wavelengths of the multi-band beam longer than a second wavelength to pass through

Methodology Applied
Scientific EffectWavelength filtering: Filter (optical)

Data Source

PatentUS9972651B2Spectrum-inspection device
Publication Date: 2018.05.15 VISERA TECH CO LTD
  • US9972651B2 patent drawing
  • US9972651B2 patent drawing
  • US9972651B2 patent drawing

AI summary

A spectrum-inspection device includes a multi-band pass filter, a filter array, and a sensing layer. The multi-band pass filter allows a first waveband, a second waveband, and a third waveband of a light beam to pass through. The light beam passes through the multi-band pass filter forms a multi-band beam. The filter array is disposed under the multi-band pass filter. The filter array includes a first filter allowing wavelengths of the multi-band beam longer than a first wavelength to pass through, a second filter allowing wavelengths of the multi-band beam longer than a second wavelength to pass through, and a third filter allowing wavelengths of the multi-band beam longer than a third wavelength to pass through. The second waveband is between the first wavelength and the second wavelength, and the third waveband is between the second wavelength and the third wavelength.