Spiral Laser Wafer Processing With Eccentricity Follow-Up Control
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Solution Overview
Problem
Existing wafer separation techniques face challenges in accurately forming internal modification layers due to eccentricity issues, which can lead to improper separation and control complexities when horizontal movement and eccentricity correction are performed by the same member.
Innovation Solution
A wafer processing system with a processing apparatus that includes a holder, a holder moving mechanism, a modifying device, and a controller to form internal modification layers in a spiral shape, allowing shared movement and eccentricity correction between the holder and the modifying device to address eccentricity and improve control precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the holder and modifying device share the movement and eccentricity correction operations, then the manufacturing precision of internal modification layers is improved, but the device complexity increases
Solution Approach 1:
The control system is segmented into two independent control mechanisms: one for spiral processing movement and another for eccentricity follow-up movement. This segmentation allows each mechanism to be optimized for its specific function, improving overall precision while maintaining manageable complexity through modular control architecture.
Solution Approach 2:
The controller acts as an intermediary that coordinates between the holder moving mechanism and modifying device moving mechanism. It synthesizes the spiral processing movement and eccentricity correction movement, enabling precise control of the laser beam relative position to the wafer center without requiring direct mechanical coupling between the holder and modifying device.
2Stability of the object's composition
If the holder and modifying device share the movement operations, then vibrations and resonance are reduced, but the ease of operation decreases
Solution Approach 1:
The system dynamically adjusts the movement of the holder and modifying device independently through coordinated control. The holder moving mechanism and modifying device moving mechanism operate with dynamic synchronization, allowing the laser beam to follow the wafer's eccentricity while maintaining spiral processing motion, thereby reducing vibrations without requiring rigid mechanical coupling.
Solution Approach 2:
The control system incorporates feedback mechanisms that monitor the relative position between the laser beam and wafer center, adjusting the holder and modifying device movements in real-time. This feedback control enables automatic compensation for eccentricity and vibration, maintaining stability while simplifying operator intervention requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise formation of internal modification layers and effective separation of wafers by simplifying control operations and reducing the risk of vibrations and resonance, thereby improving the accuracy and efficiency of the wafer processing.
Implementation Method 1
a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers in a spiral shape
Data Source
AI summary
A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a holder moving mechanism configured to move the holder in a horizontal direction; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers in a spiral shape; a modifying device moving mechanism configured to move the modifying device in the horizontal direction; and a controller configured to control an operation of forming the internal modification layers. The controller controls operations of the holder and the modifying device such that a spiral processing movement according to the formation of the internal modification layers and an eccentricity follow-up movement of correcting an eccentric amount between the holder and the processing target object held by the holder are shared by the holder and the modifying device.