Split SPAD Line Arrays With Lens Overlap for 3D Imaging
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Solution Overview
Problem
Conventional image sensors face limitations in determining object distance and have lower than desired image quality and resolution, which are addressed by incorporating single-photon avalanche diodes (SPADs) for improved light sensitivity and depth sensing capabilities.
Innovation Solution
The implementation of SPADs in imaging systems, which include passive and active quenching circuitry to detect single photons and measure photon time-of-flight, allowing for 3D imaging and increased dynamic range through the use of silicon photomultipliers and per-pixel readout capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional image sensors are used, then manufacturing is simpler, but image quality and resolution are lower than desired
Solution Approach 1:
The sensor is divided into multiple semiconductor dice, each containing a subset of the pixel array. This segmentation allows for higher resolution imaging while maintaining manageable manufacturing processes for each individual die, resolving the contradiction between image quality and manufacturing simplicity.
2Adaptability or versatility
If conventional image sensors are used, then device structure is simpler, but depth sensing capability is limited
Solution Approach 1:
The sensor system performs multiple functions: standard image capture and depth sensing. By integrating both functionalities into a single multi-functional device using the segmented architecture, the system achieves versatility without proportionally increasing complexity.
3Manufacturing precision
If sensor array size is increased to improve resolution, then image quality improves, but manufacturing difficulty increases
Solution Approach 1:
Instead of manufacturing one large high-resolution sensor array, the system uses multiple smaller semiconductor dice, each with a manageable pixel subset. These are assembled into a composite high-resolution array, achieving high image resolution while keeping individual manufacturing processes simple and feasible.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances image quality and resolution by enabling accurate depth sensing and improved light sensitivity, particularly in low-light conditions, while maintaining robust manufacturing processes for high-aspect-ratio SPAD arrays.
Implementation Method 1
single-photon avalanche diodes (SPADs) for single photon detection... Each pixel typically includes a photosensitive element (such as a photodiode) that receives incident photons (light) and converts the photons into electrical signals
Implementation Method 2
measure photon time-of-flight, allowing for 3D imaging and increased dynamic range
Data Source
AI summary
A semiconductor package may include a line array of single-photon avalanche diodes (SPADs). The line array of single-photon avalanche diodes may be split between multiple silicon dice. Each silicon die may be overlapped by at least one lens to focus light away from gaps between the dice and towards the single-photon avalanche diodes. There may be one single-photon avalanche diode for each silicon die or multiple single-photon avalanche diodes for each silicon die. When there are multiple single-photon avalanche diodes for each silicon die, lenses may be formed over only the edge single-photon avalanche diodes.