Light-Emitting Element Layout With Split Substrates for TFT Integration
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Solution Overview
Problem
Existing electronic devices with light-emitting elements and thin-film transistor arrays on the same substrate face challenges in material compatibility and manufacturing processes, leading to lower process yield and higher costs due to the need for suitable materials for both components.
Innovation Solution
The electronic device design separates the light-emitting elements and thin-film transistor arrays onto different substrates, allowing independent selection of substrate materials and manufacturing processes, enhancing process yield and reducing costs by increasing the space for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If light-emitting elements and thin-film transistor arrays are disposed on the same substrate, then device integration is achieved, but material compatibility constraints and manufacturing complexity increase
Solution Approach 1:
The device is segmented into two separate substrates: a first substrate for light-emitting elements and a second substrate for thin-film transistor arrays. This segmentation allows each substrate to be optimized independently for its specific function, eliminating material compatibility constraints while maintaining device integration through electrical connection.
Solution Approach 2:
An intermediate substrate is introduced as a mediator between the light-emitting elements and the thin-film transistor arrays. This intermediate substrate facilitates electrical connection through via holes while allowing the use of different materials on each substrate, resolving the material compatibility issue.
2Device complexity
If light-emitting elements and thin-film transistor arrays are disposed on the same substrate, then device integration is achieved, but process yield decreases
Solution Approach 1:
By segmenting the device into separate substrates for light-emitting elements and thin-film transistor arrays, each substrate can be manufactured and tested independently, improving process yield. The segmented structures reduce the risk of defects affecting the entire device and allow for better quality control at each stage.
3Device complexity
If light-emitting elements and thin-film transistor arrays are disposed on the same substrate, then device integration is achieved, but manufacturing cost increases
Solution Approach 1:
Segmenting the device into separate substrates allows for independent manufacturing optimization of each component. This reduces the need for expensive multi-material processes and enables the use of cost-effective materials and manufacturing techniques for each substrate type, thereby reducing overall manufacturing cost.
4Adaptability or versatility
If light-emitting elements and thin-film transistor arrays are disposed on different substrates, then material selection flexibility increases, but connection space requirements increase
Solution Approach 1:
The connection between substrates is achieved through via holes that extend in the vertical dimension, rather than requiring lateral connection space. This dimensional transition allows for compact integration while maintaining material selection flexibility, as the via holes provide efficient electrical connection without occupying excessive planar area.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first substrate and a plurality of light-emitting elements disposed on the first substrate. The plurality of light-emitting elements include a contact pad; an intermediate substrate disposed on the contact pad; and a light-emitting unit disposed on the intermediate substrate. The electronic device further includes a second substrate and a first thin-film transistor array disposed on the second substrate for driving at least a portion of the plurality of light-emitting elements. The light-emitting unit is electrically connected to the contact pad through a via hole that penetrates the intermediate substrate.