Display Panel Array Substrate With Split Through-Hole Connections
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Solution Overview
Problem
In the TSS pixel structure of a display panel, the connection between the TSS transparent electrode layer and the pixel electrode via deep and shallow holes can lead to undercut formation, causing disconnection of traces.
Innovation Solution
The array substrate design includes a first through-hole connecting the transparent shielding electrode to the common signal line and a second through-hole connecting the connection electrode to the transparent shielding electrode, ensuring they are spaced apart, preventing undercut formation and maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the TSS transparent electrode layer is connected to the pixel electrode via a deep hole and to the common signal line via a shallow hole, then the transmittance and storage capacitance are improved, but an undercut may be formed causing disconnection of traces
Solution Approach 1:
The patent divides the connection structure into two separate through-holes: a first through-hole connecting the TSS transparent electrode layer to the pixel electrode, and a second through-hole connecting the TSS transparent electrode layer to the common signal line. This segmentation eliminates the need for a single deep hole that would require complex etching processes, thereby preventing undercut formation while maintaining reliable electrical connectivity.
Solution Approach 2:
The patent applies different connection depths at different locations: the first through-hole extends to the pixel electrode layer while the second through-hole extends to the common signal line layer. This local differentiation allows each connection to be optimized independently, preventing undercut formation in the shallower second through-hole while maintaining the deep connection needed for the pixel electrode.
2Manufacturing precision
If the first through-hole and second through-hole are spaced apart, then undercut formation is prevented, but the device complexity increases
Solution Approach 1:
The patent combines the formation of two separate through-holes into a single etching process by designing them with different depths. The first through-hole extends through multiple layers to reach the pixel electrode, while the second through-hole extends to a lesser depth to reach the common signal line. This merging of processes simplifies manufacturing despite the spatial separation of the holes.
Data Source
AI summary
The present application provides an array substrate and a display panel. The array substrate includes a substrate, a common signal line disposed on the substrate, a data line disposed on a side of the common signal line facing away from the substrate, a pixel electrode and a connection electrode spaced from each other and disposed on a side of the data line facing away from the common signal; and a transparent shielding electrode located between the data line and the pixel electrode. The transparent shielding electrode is connected to the common signal line via a first through-hole, the connection electrode is connected to the transparent shielding electrode via a second through-hole, in a plan view of the array substrate, the first through-hole is located within a region of the pixel electrode and the second through-hole is located within a region of the connection electrode.