Spring-Biased Heat Sink With Segmented Fin Plates
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Solution Overview
Problem
Existing heat management systems for electrical components face inefficiencies in thermal energy transfer due to limited thermal interface areas and surface variations, leading to degraded performance and potential damage from heat generation.
Innovation Solution
A heat sink assembly comprising a plate stack with fin plates and spacer plates, supported by a spring element and frame, which forms a compliant thermal interface and airflow channels to enhance thermal coupling and dissipation, allowing for efficient heat transfer from electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat thermal interface is used to interface with the electrical component, then the thermal component can transfer thermal energy, but the thermal coupling efficiency is reduced due to limited thermal interface areas and surface variations
Solution Approach 1:
The heat sink assembly is segmented into multiple fin plates arranged in a stacked configuration, creating multiple discrete thermal interface surfaces. Each fin plate provides an additional thermal interface area with the electrical component, effectively multiplying the total thermal contact area beyond what a single flat interface could provide. This segmentation allows the system to overcome the limitation of limited interface area while maintaining reliable thermal coupling.
Solution Approach 2:
The patent transitions from a two-dimensional flat thermal interface to a three-dimensional stacked arrangement of fin plates. By adding the vertical dimension through stacking, the thermal interface area is expanded without increasing the horizontal footprint. This dimensional change allows multiple thermal interfaces to be stacked vertically, each providing contact with the electrical component while maintaining a compact overall structure.
2Reliability
If rigid thermal components are used, then structural stability is maintained, but thermal coupling efficiency decreases due to surface flatness variations and limited adaptability to the electrical component surface
Solution Approach 1:
The heat sink assembly incorporates spring elements that provide dynamic, compliant contact with the electrical component. These springs allow the fin plates to adapt their position and pressure in response to surface variations in the electrical component, ensuring consistent thermal coupling across uneven surfaces. The dynamic nature of the spring mechanism enables the rigid fin plates to conform to surface irregularities while maintaining structural integrity.
Solution Approach 2:
The patent changes the mechanical parameter of the thermal component from rigid and fixed to compliant and adjustable through the spring mechanism. This parameter change allows the thermal interface to adapt to varying surface conditions, including flatness variations and dimensional tolerances of the electrical component. The spring pressure can be tuned to optimize thermal contact while accommodating surface variations.
3Loss of energy
If multiple thermal interfaces are used to transfer thermal energy, then thermal energy can be transferred through additional paths, but efficiency is lost at each thermal interface due to contact resistance and surface variations
Solution Approach 1:
The fin plates are thermally merged or closely coupled with the spacer plates to create an integrated thermal pathway. This merging reduces thermal resistance at the interfaces between components by ensuring intimate thermal contact through the spring-loaded arrangement. The combined structure acts as a unified thermal conduction path, minimizing energy loss at individual interfaces while maintaining the benefits of multiple contact points with the electrical component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat sink assembly effectively dissipates heat from electrical components by improving thermal coupling and airflow, thereby enhancing system performance and preventing damage from thermal energy buildup.
Implementation Method 1
The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component
Implementation Method 2
The heat sink assembly includes a plate stack including fin plates and spacer plates arranged between the fin plates in a stacked arrangement... The bottom edges of the fin plates and the bottom edges of the spacer plates form a compliant thermal interface configured to interface with an electrical component
Implementation Method 3
The upper edges of the fin plates are located above the upper edges of the spacer plates such that airflow channels are formed above the spacer plates between the fin plates
Data Source
AI summary
A heat sink assembly includes a plate stack including fin plates and spacer plates with bottom edges forming a compliant thermal interface configured to interface with an electrical component. Upper edges of the fin plates are located above the spacer plates to form airflow channels between the fin plates. The heat sink assembly includes a support frame supporting the fin plates and the spacer plates in the plate stack. The support frame includes a spring support member engaging a spring element to locate the spring element relative to the support frame. The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component.