Spring-Driven Bond Tool for Precise Die Attach Force Control
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Solution Overview
Problem
Conventional die attach systems face challenges in controlling bond force during the bonding operation, leading to inefficiencies and inaccuracies in attaching dies to substrates without proper control mechanisms.
Innovation Solution
A die attach system with a bond head that includes a spring-loaded bond tool, allowing for precise control of the bond force by compressing during the transfer of a die from a supply source to a substrate, utilizing a detection system to measure compression and adjust movement accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional bond tool is used to press the die against the substrate, then the die attach operation can be performed without picking and placing, but poor control of bond force is achieved
Solution Approach 1:
The bond tool is transformed from a rigid structure to a dynamic compliant structure by incorporating a spring mechanism. The spring allows the bond tool to flex and adapt to variations in die thickness and substrate surface, enabling precise bond force control while maintaining high productivity in die attach operations.
Solution Approach 2:
The spring constant of the spring is carefully selected and adjustable to control the bond force parameter. By changing the spring constant or pre-compression force, the system can precisely control the bond force applied to the die during attachment, resolving the contradiction between productivity and manufacturing precision.
2Device complexity
If a rigid bond tool is used for die attachment, then structural simplicity is maintained, but impact on the die during bonding cannot be reduced
Solution Approach 1:
The spring mechanism is pre-configured to compress during the bonding process, absorbing impact forces before they reach the die. This beforehand cushioning protects the die from harmful impacts while maintaining relatively simple device structure, as the spring is integrated into the existing bond tool architecture.
3Ease of manufacture
If conventional die attach systems are used, then basic bonding function is achieved, but precise measurement of bond force compression is not possible
Solution Approach 1:
A detection system is integrated into the bond tool to provide real-time feedback on spring compression and bond force. This feedback mechanism enables precise measurement and control of bonding parameters while maintaining ease of manufacture, as the detection system uses standard sensors and control electronics that can be incorporated into existing manufacturing lines.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise control of bond force, reduces impact on the die, optimizes bonding processes, and detects irregularities, enhancing the accuracy and reliability of die attachment.
Implementation Method 1
the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate
Data Source
AI summary
A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.