Spring-Loaded Thermal Transfer Device for Processor Height Variation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Efficient thermal management of multiple high-powered processors in electronic packages is complicated by varying heights due to manufacturing tolerances, which can lead to premature failures and reduced component lifespan, especially in sealed environments.
Innovation Solution
A spring-loaded thermal transfer device using heat-pipes and compressive springs to accommodate varying processor heights, ensuring consistent thermal contact and vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used in sealed environments, then thermal management is achieved, but the systems become costly, sizable, and complex
Solution Approach 1:
The cooling system is segmented into multiple heat pipes, each independently managing heat from specific processor locations. This segmentation allows distributed thermal management without requiring a single complex centralized cooling system, reducing overall system complexity while maintaining effective temperature control across multiple processors.
Solution Approach 2:
Heat pipes serve as intermediary thermal transfer elements between the processors and the cooling system. These heat pipes act as mediators that passively transfer heat from the processor surfaces to the cooling structures, eliminating the need for direct complex active cooling connections and simplifying the overall thermal management architecture.
2Reliability
If solder joints are used to attach components, then electrical connection is achieved, but dimensional tolerances vary and assembly becomes time-consuming
Solution Approach 1:
The thermal transfer device incorporates movable pads that can dynamically adjust their position vertically to accommodate variations in processor heights and solder joint dimensions. This dynamic adjustment capability allows the pads to self-align with processors despite tolerance variations, eliminating the need for time-consuming manual adjustment or complex fixture systems.
Solution Approach 2:
The vertical position of the pads is made variable through the movable pad structure, allowing the system to adapt to different dimensional parameters within tolerance ranges. This parameter change capability enables consistent thermal contact across all processors despite variations in solder joint heights, reducing assembly time and complexity.
3Ease of manufacture
If fixed thermal contact is used, then manufacturing is simplified, but varying processor heights prevent consistent thermal connection
Solution Approach 1:
The movable pad structure transforms the fixed thermal contact requirement into a dynamic system where pads can adjust their vertical position to maintain consistent contact with processors of varying heights. This dynamic capability resolves the conflict between manufacturing simplicity and precision by allowing tolerance variations in processor heights without compromising thermal connection consistency.
Solution Approach 2:
The movable pad design incorporates built-in compliance and adjustment capability that compensates for future height variations before assembly. This beforehand cushioning approach ensures that thermal contact consistency is maintained despite manufacturing tolerances, eliminating the need for overly precise manufacturing while still achieving reliable thermal connection.
4Temperature
If multiple components are used to ensure intimate contact, then thermal connection is improved, but the assembly becomes overly-stressed and complex
Solution Approach 1:
The movable pads integrate multiple functions into a single component structure, combining thermal transfer, mechanical compliance, and positional adjustment capabilities. This merging reduces the number of separate components needed to achieve intimate thermal contact, simplifying the assembly while maintaining effective thermal connection across multiple processors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides uniform heat transfer and vibration protection for multiple processors, maintaining optimal operating temperatures and extending component life.
Implementation Method 1
The one or more heat-pipes are attached to the condenser plate and the plurality of pads and are configured to move in the vertical direction
Implementation Method 2
transfer to the condenser plate, thermal energy received by each of the plurality of pads from the plurality of integrated circuits
Implementation Method 3
A spring-loaded thermal transfer device using heat-pipes and compressive springs to accommodate varying processor heights
Data Source
AI summary
An assembly includes a condenser plate, a plurality of pads and one or more heat-pipes. The condenser plate includes a plurality of apertures. Each of the plurality of apertures overlaps a location of a corresponding one of a plurality of integrated circuits. Each of the plurality of pads is disposed within each of the plurality of apertures and is configured to move in a vertical direction. The one or more heat-pipes are attached to the condenser plate and the plurality of pads and are configured to move in the vertical direction. Each of the plurality of pads is configured to be in thermal connection with the corresponding one of the plurality of integrated circuits by a movement of the one or more heat-pipes in the vertical direction to transfer to the condenser plate, thermal energy received by each of the plurality of pads from the plurality of integrated circuits.