Sputter Deposition Magnet Arrangement for Plasma Confinement
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Solution Overview
Problem
Current sputter deposition processes are inefficient due to delays in target replacement and priming, and they often require separate plasma sources, leading to space inefficiencies and inconsistent deposition.
Innovation Solution
A sputter deposition apparatus with a magnet arrangement that confines plasma in both the target priming and deposition zones, allowing for efficient plasma use and target priming, and a target loading system that enables seamless target replacement and multiple target materials usage, improving deposition efficiency and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate plasma source is used for target priming, then target priming can be performed, but it requires additional space and increases device complexity
Solution Approach 1:
The single plasma source is designed to perform multiple functions: it can generate plasma for both target priming and for sputter deposition. The plasma source can be moved or reconfigured to treat targets in the priming zone and then confine plasma to the deposition zone, eliminating the need for separate plasma sources while maintaining both priming and deposition capabilities
Solution Approach 2:
The patent combines the target priming function and sputter deposition function into a single integrated system with one plasma source. The magnet arrangement and plasma source work together to confine plasma to different zones as needed, merging what would traditionally require separate equipment into a unified apparatus that reduces complexity and space requirements
2Reliability
If targets are replaced and primed in the deposition zone, then fresh targets can be used, but it causes delays in the sputter deposition process
Solution Approach 1:
The system performs target priming in advance in a dedicated priming zone before the target is transferred to the deposition zone. This preliminary action ensures the target is properly prepared and eliminates the need for time-consuming priming operations during deposition, thereby reducing delays while maintaining deposition consistency
Solution Approach 2:
The apparatus is divided into functionally separate zones: a target priming zone where targets are prepared, and a sputter deposition zone where deposition occurs. This segmentation allows target preparation and deposition operations to occur in separate spatial and temporal domains, enabling efficient target replacement without interrupting the deposition process
3Reliability
If plasma is generated in both target priming and sputter deposition zones, then comprehensive plasma treatment is achieved, but it increases energy consumption
Solution Approach 1:
The magnet arrangement is designed to extract and confine plasma to only the specific zone where it is needed at any given time. During target priming, plasma is confined to the priming zone; during deposition, plasma is confined to the deposition zone. This extraction of plasma from unnecessary zones reduces energy consumption while maintaining deposition uniformity through appropriate zone-specific plasma treatment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces delays, enhances space efficiency, and achieves more consistent and uniform sputter deposition by allowing for efficient plasma use and flexible target material handling, improving the overall deposition process.
Implementation Method 1
a plasma source to generate a plasma
Implementation Method 2
a magnet arrangement configured to confine the plasma within the apparatus to: the target priming zone, within which a respective target is exposed to the plasma in use; and the sputter deposition zone
Implementation Method 3
a magnet arrangement configured to confine the plasma within the apparatus to: the target priming zone, within which a respective target is exposed to the plasma in use; and the sputter deposition zone
Implementation Method 4
Bombardment of the target by ions of the plasma eject target material which may then deposit on the substrate surface
Data Source
AI summary
Certain examples described herein relate to a sputter deposition apparatus including a substrate holder, a target loader, a plasma source to generate a plasma, and a magnet arrangement. The substrate holder is to position a substrate in a sputter deposition zone for sputter deposition of target material from a first target to the substrate in use. The target loader is to move a second target from a target priming zone into the sputter deposition zone for sputter deposition of target material from the second target to the substrate in use. The magnet arrangement configured to confine the plasma within the apparatus to the target priming zone and the sputter deposition zone. Within the target priming zone, a respective target is exposed to the plasma in use. The sputter deposition zone provides for sputter deposition of target material.