Sputtering Cathode Azimuthal Magnet Arrangement
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Solution Overview
Problem
Traditional sputtering cathodes inefficiently utilize the magnetic field, resulting in limited electron trapping and plasma concentration due to field lines penetrating the target, which restricts the enhancement of parallel magnetic field lines above the target surface.
Innovation Solution
The sputtering cathode design employs an arrangement of magnets to generate an azimuthal magnetic field that surrounds the entire outward-facing surface of the sputtering target, allowing magnetic field lines to form around the target with minimal penetration, thereby increasing electron trapping and plasma concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If magnetic field lines penetrate through the sputtering target to produce a small fraction of parallel field lines, then the traditional cathode structure is simple, but electron trapping and plasma concentration are limited
Solution Approach 1:
The magnet assembly is divided into multiple permanent magnets arranged in an alternating polarity pattern around the sputtering target. This segmentation allows each magnet to contribute to creating parallel magnetic field lines above the target surface, collectively achieving enhanced electron trapping without requiring a single complex magnet structure
Solution Approach 2:
The magnetic field configuration transitions from traditional penetration through the target to an azimuthal arrangement where field lines run parallel to and above the target surface. This dimensional change in field line orientation creates electron trapping regions without requiring field penetration, thereby improving plasma concentration while maintaining structural feasibility
2Productivity
If magnetic field lines run parallel to and above the sputtering target surface, then electron trapping is enhanced, but the magnet arrangement becomes more complex
Solution Approach 1:
Multiple permanent magnets with alternating polarities are merged into a unified azimuthal arrangement around the sputtering target. This combination creates a cohesive magnetic field structure where individual magnet contributions integrate to produce the desired parallel field lines, achieving enhanced plasma concentration through a systematically combined rather than overly complex assembly
Solution Approach 2:
The magnet arrangement is configured to create locally optimized magnetic field conditions at different positions around the sputtering target. Each magnet segment produces field lines tailored to its specific location, collectively forming an azimuthal pattern that enhances electron trapping throughout the plasma region without requiring uniform complexity across the entire structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electron trapping and plasma concentration, enabling the sputtering cathode to operate at lower vacuum pressures and improve ion production, with the system running at pressures one order of magnitude less than traditional setups.
Implementation Method 1
a magnet having a body of length L1 defining a north magnetic pole at a first end of the body and a south magnetic pole at a second, opposite end of the body; and a sputtering target of length L2 surrounding the body of the magnet
Implementation Method 2
magnetic field lines that are parallel to and above the face of the sputtering target are the field lines responsible for electron trapping and thus concentration of the sputtering plasma
Implementation Method 3
Disclosed herein is an example sputtering cathode that utilizes the entire magnetic field that surrounds the sputtering target
Data Source
AI summary
A sputtering cathode includes a magnet having a body of length L1 defining a north magnetic pole at a first end of the body and a south magnetic pole at a second, opposite end of the body. A sputtering target of length L2 surrounds the body of the magnet, but not ends of the magnet.