Multi-Chamber Sputtering Apparatus for Sequential Thin Film Deposition
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Solution Overview
Problem
Conventional multi-layered thin film manufacturing apparatuses face challenges such as reduced throughput due to longer processing times for films with varying thicknesses, interlayer cross-contamination, increased cost and footprint, and inability to form films with multiple elements, especially when sequential substrate transfer is not feasible.
Innovation Solution
A manufacturing apparatus is designed with a configuration of multiple sputtering deposition chambers, including one chamber with one cathode and others with multiple cathodes, along with a transfer chamber and an etching chamber, allowing for sequential substrate transfer and improved throughput by optimizing film deposition processes across different chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple sputtering cathodes are installed in one deposition chamber, then device complexity is reduced and cost is lowered, but interlayer cross-contamination occurs and manufacturing precision deteriorates
Solution Approach 1:
The patent divides the deposition system into multiple independent deposition chambers, each dedicated to depositing specific film layers. This segmentation prevents cross-contamination between different film materials while maintaining a relatively simple overall apparatus structure through shared transfer and processing infrastructure.
Solution Approach 2:
The patent introduces a transfer chamber as an intermediary between deposition chambers and processing chambers. This transfer chamber serves as a buffer zone that enables substrate transfer without direct exposure between different deposition environments, preventing cross-contamination while facilitating efficient process sequencing.
2Manufacturing precision
If sequential substrate transfer is implemented, then manufacturing precision is improved by preventing cross-contamination, but loss of time increases due to repeated transfers
Solution Approach 1:
The patent performs preliminary actions by pre-configuring multiple deposition chambers with different film deposition capabilities and pre-establishing transfer pathways through the transfer chamber. This allows substrates to be rapidly transferred between pre-prepared chambers without requiring complex real-time reconfiguration, reducing time loss while maintaining precision.
Solution Approach 2:
The patent implements continuous useful action by enabling parallel processing where multiple deposition operations can occur simultaneously in different chambers while substrates are transferred through the shared transfer chamber. This continuity minimizes idle time and maintains high manufacturing precision through consistent process conditions.
3Productivity
If multiple deposition chambers are used, then productivity is improved by enabling parallel processing, but device complexity and cost increase
Solution Approach 1:
The patent implements universality by designing the transfer chamber to serve multiple functions: transferring substrates between deposition chambers, transferring substrates to processing chambers, and acting as a vacuum buffer zone. This multi-functionality enables parallel processing and high throughput while avoiding the need for separate dedicated transfer pathways for each chamber pair.
Solution Approach 2:
The patent merges multiple deposition chambers and processing chambers into a unified system sharing common transfer infrastructure and vacuum environment. This combining approach enables parallel processing operations that improve productivity while controlling overall device complexity through shared resources and standardized interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances throughput while maintaining low costs and preventing interlayer cross-contamination, enabling efficient formation of multi-layered thin films with varying thicknesses and multiple elements without the need for repeated substrate transfers.
Implementation Method 1
a first sputtering deposition chamber (13A) including one sputtering cathode (31), a second sputtering deposition chamber (13C) including one sputtering cathode (31), a third sputtering deposition chamber (13E) including one sputtering cathode (31), a fourth sputtering deposition chamber (13B) including two or more sputtering cathodes (31), and a fifth sputtering deposition chamber (13D) including two or more sputtering cathodes (31)
Implementation Method 2
an etching chamber (14) for removing oxide and contamination on a substrate (25) surface
Data Source
AI summary
The present invention provides a manufacturing apparatus which can realize so-called sequential substrate transfer and can improve throughput, even when one multi-layered thin film includes plural layers of the same film type. A manufacturing apparatus according to an embodiment of the present invention includes a transfer chamber, three sputtering deposition chambers each including one sputtering cathode, two sputtering deposition chambers each including two or more sputtering cathodes, and a process chamber for performing a process other than sputtering, and the three sputtering deposition chambers, the two sputtering deposition chambers, and the process chamber are arranged around the transfer chamber so that each is able to perform delivery and receipt of the substrate with the transfer chamber.