Sputtering Device Gas Distribution Tubes
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Solution Overview
Problem
As the size of substrates increases, the uniformity of thin films deposited using traditional sputtering devices deteriorates, leading to non-uniform thin film formation, particularly in large-sized substrates used in liquid crystal displays.
Innovation Solution
The sputtering device incorporates a gas distribution system with multiple discharge holes arranged parallel to the anode mask, allowing for uniform gas distribution between the sputtering target and substrate, and includes magnetrons to enhance plasma generation and ionization, ensuring consistent thin film deposition across larger substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate size is increased, then the productivity and display area are improved, but the uniformity of thin film deposition deteriorates
Solution Approach 1:
The gas distribution system is segmented into multiple separate gas distribution tubes arranged in the vertical direction, with each tube having multiple discharge holes. This segmentation allows independent control of gas flow to different regions of the substrate, enabling uniform plasma generation across large substrate areas while maintaining thin film uniformity.
Solution Approach 2:
Different regions of the substrate receive tailored gas distribution through specifically positioned discharge holes in the gas distribution tubes. The discharge holes are arranged to face different directions (toward substrate, toward target, or both) to create locally optimized plasma conditions for each region, ensuring uniform deposition across the entire large substrate area.
2Device complexity
If traditional gas distribution is used, then the device structure is simple, but gas distribution uniformity and plasma generation consistency deteriorate
Solution Approach 1:
The gas distribution system is divided into multiple separate gas distribution tubes positioned vertically between the substrate and target. Each tube contains multiple discharge holes at different positions and orientations, enabling precise local control of gas flow to achieve uniform plasma generation across the entire substrate area.
Solution Approach 2:
Gas distribution is extended from a single-plane configuration to a three-dimensional arrangement with multiple vertical tubes positioned at different heights. The discharge holes are oriented in multiple directions (upward toward substrate, downward toward target, or both), creating multi-dimensional gas distribution that ensures uniform plasma generation across large substrate areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform plasma generation and gas distribution, resulting in improved uniformity and quality of thin films deposited on larger substrates, addressing the issue of non-uniformity and enhancing the deposition process for larger substrates in liquid crystal displays.
Implementation Method 1
a gas distribution member between the anode mask and the sputtering target, and including a plurality of gas distribution tubes separated from each other, where each gas distribution tube includes a plurality of discharge holes defined therein and through which gas is discharged to a vacuum chamber
Implementation Method 2
a plurality of magnetrons on the sputtering target and generating a magnetic field
Implementation Method 3
When a voltage is applied in a vacuum state and argon (Ar) gas or oxygen (O2) gas is injected, ions collide with a target while the argon (Ar) gas or the oxygen (O2) gas is ionized. In this case, atoms are discharged from the target and the discharged atoms are attached to the substrate for a semiconductor device or to the substrate for a liquid crystal display, to form the thin film
Implementation Method 4
When a voltage is applied in a vacuum state and argon (Ar) gas or oxygen (O2) gas is injected, ions collide with a target while the argon (Ar) gas or the oxygen (O2) gas is ionized
Data Source
AI summary
A sputtering device includes: a sputtering target; a substrate supporter facing the sputtering target and upon which a substrate is disposed; an anode mask between the sputtering target and the substrate which is on the substrate supporter; and a gas distribution member between the anode mask and the sputtering target, and including a plurality of gas distribution tubes separated from each other. Each gas distribution tube includes a plurality of discharge holes defined therein and through which gas is discharged to a vacuum chamber configured to receive the sputtering device.