Sputtering Apparatus Isolated Space Pressure Discrimination
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Solution Overview
Problem
Conventional sputtering apparatuses face challenges in accurately determining whether the vacuum chamber is in a suitable state for film formation due to variations in clearance between isolating plates, leading to inconsistencies in pressure and film quality.
Innovation Solution
A method and apparatus that measure the pressure in the isolated space within the vacuum chamber using a vacuum gauge through penetrating holes in the isolating block, allowing for discrimination of the sputtering apparatus state by comparing the measured pressure to a reference pressure, and optionally measuring pressure differences and changes to confirm the assembly position and exhaust system functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the clearance between isolating plates is set to 2-3 mm to prevent plasma leakage, then plasma containment is improved, but film thickness uniformity deteriorates due to sputtered particle adhesion to isolating plates
Solution Approach 1:
A gauge head is introduced as an intermediary component in the isolated space to measure pressure. The gauge head is positioned such that it does not interfere with the isolating plates' function of preventing plasma leakage, while enabling pressure measurement to monitor film formation conditions and detect isolating plate assembly issues.
2Device complexity
If pressure in the vacuum chamber is measured to estimate isolated space pressure, then device complexity is reduced, but discrimination accuracy deteriorates due to clearance variations
Solution Approach 1:
The gauge head acts as an intermediary measurement device positioned specifically in the isolated space. This allows direct pressure measurement in the region where film formation occurs, providing accurate data on the actual conditions during sputtering without requiring complex calculations or estimations based on vacuum chamber pressure.
Solution Approach 2:
The pressure measurement system provides feedback about the actual conditions in the isolated space. By comparing measured pressure values with expected values, the system can detect deviations caused by isolating plate assembly variations and adjust or alert operators to maintain optimal film formation conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise discrimination of the vacuum chamber state for film formation, reducing maintenance time by identifying potential issues before actual sputtering, and preventing film quality deviations by ensuring accurate pressure and plasma density.
Implementation Method 1
measuring a pressure in the isolated space; comparing the measured pressure with a reference pressure when film formation is performed at a predetermined in-plane film thickness and film quality distribution
Implementation Method 2
sputtering a target, a film is formed on a substrate disposed to lie opposite to the target
Implementation Method 3
when RF (radio frequency) power is applied to the target, a plasma does not leak through the clearance between the respective isolating plates
Implementation Method 4
an evacuating means which evacuates the inside of the vacuum chamber; evacuating in advance the vacuum chamber to a predetermined set pressure
Data Source
AI summary
A method of discriminating a state of a sputtering apparatus in which, by sputtering a target, a film is formed on a substrate disposed to lie opposite to the target, the discrimination being made, prior to the film formation on the substrate, as to whether an atmosphere in the vacuum chamber is in a state fit for film formation. As the sputtering apparatus, use is made of one provided inside the vacuum chamber with an isolated space which is isolated from the vacuum chamber by an isolating means (6, 71˜73), the isolated space being for the target and the substrate to lie therein opposite to each other, the sputtering apparatus being so arranged that the isolated space is evacuated accompanied by the evacuation in the vacuum chamber. The vacuum chamber is evacuated to a predetermined set pressure and a gas is introduced therein in this state.