Sputtering Layer Structure for Display Panel Adhesion
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Solution Overview
Problem
The bonding strength between the connection pad of a display panel and its conductive terminal is poor, leading to peeling issues and reduced yield due to inadequate adhesive force between metal layers.
Innovation Solution
The electronic device incorporates a second conductive layer with a sputtering layer structure, where the first sputtering layer directly contacts the insulating layer, enhancing adhesive force, and the third sputtering layer protects the second sputtering layer from oxidation, improving bonding strength and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a molybdenum (Mo) layer is disposed between two adjacent metal layers to strengthen adhesive force, then the peeling resistance between metal layers is improved, but the bonding strength at the connection pad to conductive terminal deteriorates
Solution Approach 1:
The second conductive layer is segmented into three separate sputtering layers (first, second, and third sputtering layers), each with distinct material compositions and functions. This segmentation allows optimization of each layer's properties: the first layer provides adhesion to the insulating layer, the second layer provides bonding strength to the conductive terminal, and the third layer provides oxidation protection, thereby resolving the contradiction between inter-layer adhesion and terminal bonding strength
Solution Approach 2:
Each sputtering layer is composed of different metal materials with specific properties. The first sputtering layer contains metal materials optimized for adhesion to the insulating layer, the second sputtering layer contains metal materials optimized for bonding to the conductive terminal, and the third sputtering layer contains oxidation-resistant metal materials. This composite material approach allows simultaneous optimization of multiple functional requirements that cannot be achieved with a single homogeneous layer
2Strength
If the second sputtering layer is exposed to enhance bonding, then the bonding strength to conductive terminal is improved, but the oxidation resistance deteriorates
Solution Approach 1:
The third sputtering layer acts as an intermediary protective barrier between the second sputtering layer (which provides bonding strength) and the external environment (which causes oxidation). This intermediary layer allows the second layer to maintain its bonding function while being protected from harmful oxidation, effectively decoupling the bonding function from oxidation exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration strengthens the adhesive force between the conductive layers and insulating layers, reducing peeling and enhancing the yield of the electronic device by ensuring a robust conductive connection.
Implementation Method 1
The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer
Data Source
AI summary
An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.