Sputtering Apparatus Shutter Shield Gas Diffusion
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Solution Overview
Problem
Existing sputtering apparatuses lack a mechanism to selectively increase pressure near the target for plasma ignition, requiring overall chamber pressure increase, which is inefficient.
Innovation Solution
A sputtering apparatus design featuring a shutter unit, first and second shields, and a gas supply unit that creates a gas diffusion space to selectively increase pressure near the target by forming gaps and protruding portions, allowing gas to flow into spaces near the target while preventing sputtering particles from entering, enabling controlled plasma ignition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the overall pressure in the vacuum chamber is increased for plasma ignition, then plasma ignition can be achieved, but the pressure control precision for sputtering deteriorates and the ignition efficiency decreases
Solution Approach 1:
The vacuum chamber is segmented into multiple pressure zones using shutters and shields. The space near the target is separated from the main chamber, allowing independent pressure control in each zone. This enables the target area to maintain higher pressure for ignition while the rest of the chamber maintains lower pressure for precise sputtering control.
Solution Approach 2:
Different regions of the chamber are given different pressure characteristics. The target area receives localized gas supply through the gas supply unit to create a high-pressure zone specifically where plasma ignition is needed, while other regions maintain lower pressure. This local differentiation resolves the contradiction between needing high pressure for ignition and low pressure for precision sputtering.
2Reliability
If the overall pressure in the vacuum chamber is increased for plasma ignition, then plasma ignition can be achieved, but the energy consumption increases
Solution Approach 1:
The chamber is divided into zones with selective gas supply. Only the target area requires high pressure for ignition, so gas is supplied locally to that region rather than pressurizing the entire chamber. This segmentation reduces the total volume requiring high pressure, thereby reducing energy consumption while maintaining reliable ignition.
Solution Approach 2:
Gas is supplied locally to the target area through the gas supply unit positioned near the target. This creates a high-pressure zone only where needed for plasma ignition, rather than increasing pressure throughout the entire chamber. This localized approach minimizes energy consumption while ensuring reliable ignition at the target.
3Device complexity
If the shutter is positioned close to the target for compact design, then the device complexity is reduced, but the gas distribution uniformity deteriorates
Solution Approach 1:
A gas diffusion space is introduced as an intermediary between the gas supply unit and the target area. This diffusion space allows gas to distribute uniformly before reaching the target, compensating for the compact shutter positioning. The diffusion space acts as a mediator that ensures even gas distribution without requiring the shutter to be positioned far from the target.
Solution Approach 2:
The gas supply approach is moved from direct linear supply to a three-dimensional diffusion space. Gas is supplied into a volumetric diffusion region rather than directly along a linear path, allowing uniform distribution in multiple directions. This dimensional change enables compact shutter positioning while maintaining gas distribution uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient plasma ignition by creating a higher pressure environment near the target, facilitating quick plasma generation and reducing pressure variations across multiple targets.
Implementation Method 1
a gas supplied into the gas diffusion space by the gas supply unit is capable of moving through the first gap toward a space near the target
Data Source
AI summary
A sputtering apparatus includes a shutter arranged having a first surface on a side of a substrate holder and a second surface on the opposite side, a first shield having a third surface including a portion facing the second surface and a fourth surface on the opposite side, a second shield having a fifth surface including a portion facing end portions of the shutter and the first shield, and a gas supply unit supplying a gas into a space arranged outside the first shield to communicate with a first gap between the second surface of the shutter and the third surface of the first shield. The second shield includes a protruding portion on the fifth surface to form a second gap between the protruding portion and the end portion of the shutter.