Sputtering Apparatus Shutter Plate Segmentation
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Solution Overview
Problem
Sputtering apparatuses face contamination issues between targets due to sputtered particles adhering to unused targets and adjacent surfaces, which complicates the switching process and reduces reliability and productivity.
Innovation Solution
A sputtering apparatus with a deposition preventing plate and a shutter plate featuring concentric concavo-convex shapes that rotate to shield or expose targets, preventing sputtered particles from reaching unused targets and maintaining reliability by ensuring the plates do not contact each other during rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a shutter mechanism is provided between the targets and the substrate to switch between targets, then target switching capability is improved, but sputtered particles still adhere to unused targets and adjacent surfaces causing contamination
Solution Approach 1:
The deposition preventing plate is divided into multiple plates arranged side by side, each corresponding to a specific target. This segmentation allows each plate to independently block sputtered particles from its adjacent targets, preventing contamination while maintaining the ability to switch between targets for deposition.
Solution Approach 2:
The deposition preventing plate acts as an intermediary structure positioned between the targets and the substrate. It blocks the harmful sputtered particles from reaching unused targets and adjacent surfaces, while allowing selective deposition on the substrate through controlled positioning of the plates.
2Object-affected harmful factors
If multiple gas introduction tubes and valves are provided near each target to prevent contamination, then contamination prevention is improved, but the apparatus complexity and gas management become more complicated
Solution Approach 1:
The contamination prevention function is extracted from the complex gas introduction system and implemented by the deposition preventing plate structure. This eliminates the need for multiple gas tubes and valves near each target, simplifying the apparatus while maintaining effective contamination prevention through physical blocking of sputtered particles.
3Speed
If the shutter plate rotates to shield or expose targets, then target switching speed is improved, but the risk of contact between rotating plates increases
Solution Approach 1:
The deposition preventing plate is segmented into multiple independent plates that can be positioned and fixed independently. This segmentation allows each plate to be adjusted to its optimal position without interfering with adjacent plates, enabling fast target switching while eliminating the risk of contact between rotating components.
Solution Approach 2:
The system transitions from a rotating shutter mechanism to a dynamically positionable segmented plate structure. The plates can be moved and fixed to different positions to achieve rapid target switching, while their segmented nature and fixed positioning eliminate mechanical contact risks associated with rotation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses contamination between targets, maintains apparatus reliability, and allows for efficient switching and continuous deposition without impairing the sputtering performance.
Implementation Method 1
a sputtering apparatus including a vacuum chamber 201, a substrate stage 206 provided in the vacuum chamber 201 and configured to hold a substrate 207, a plurality of cathode electrodes 203a and 203b provided to face the substrate stage 206 and configured to hold a target 203a or 203b, and a shutter plate 208 arranged between a deposition preventing plate 209 and the substrate stage 206
Data Source
AI summary
A sputtering apparatus includes a deposition preventing plate arranged between a substrate stage and a plurality of cathode electrodes, and a shutter plate arranged between the deposition preventing plate and the substrate stage. The deposition preventing plate has holes at positions respectively facing a plurality of targets held by the plurality of cathode electrodes. Concentric concavo-convex shapes centered on the rotation axis of the shutter plate are formed on surfaces, that face each other, of the deposition preventing plate and the shutter plate.