Sputtering Target Bonding via Elevated Pre-positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for producing sputtering targets face challenges in achieving high bonding strength between the target material and the backing plate material, often requiring high pressure and longer processing times, which can lead to increased costs and potential deterioration of the target material.
Innovation Solution
A process where the target material is incorporated into the backing plate material such that its uppermost position is higher than the backing plate's frame, allowing for uniaxial diffusion-bonding using a hot press, reducing pressure and time requirements while enhancing bonding strength through the use of a plating layer and specific material selections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If hot isostatic pressing is used to perform diffusion-bonding, then bonding strength is improved, but processing time and cost increase
Solution Approach 1:
The target material is pre-positioned inside the frame part with its uppermost position higher than the frame part's uppermost position. This preliminary arrangement allows the hot plate to directly contact and heat the target material during uniaxial pressing, eliminating the need for complex hot isostatic pressing equipment and procedures while achieving sufficient bonding strength.
2Strength
If hot isostatic pressing is used to perform diffusion-bonding, then bonding strength is improved, but processing cost increases
Solution Approach 1:
The target material is pre-positioned inside the frame part with its uppermost position higher than the frame part's uppermost position. This preliminary arrangement allows the hot plate to directly contact and heat the target material during uniaxial pressing, eliminating the need for complex hot isostatic pressing equipment and procedures while achieving sufficient bonding strength.
3Strength
If high pressure is applied during diffusion-bonding, then bonding strength is improved, but target material deterioration increases
Solution Approach 1:
The target material is pre-positioned inside the frame part with its uppermost position higher than the frame part's uppermost position. This preliminary arrangement allows the hot plate to directly contact and heat the target material during uniaxial pressing, achieving sufficient bonding strength without requiring excessive pressure that would cause material deterioration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a sputtering target with increased bonding strength, reduced processing costs, and minimized material deterioration, as evidenced by improved bonding strength and grain size stability.
Implementation Method 1
a bonding step of diffusion-bonding the target material to the backing plate material
Implementation Method 2
in a case of heating the target material by a hot plate while pressing from above
Data Source
AI summary
A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising:an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; anda bonding step of diffusion-bonding the target material to the backing plate material.