SRAM Writeability Recovery via Bias Temperature Instability Healing

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Solution Overview

Problem

Bias temperature instability (BTI) remains a key reliability concern in advanced CMOS technologies, particularly in SRAM arrays, leading to yield reductions and field failures due to unequal BTI effects across different elements, which current voltage-guard-bands fail to effectively address cost-effectively.

Innovation Solution

A method and system that apply controlled selective bias voltages to specific bits in SRAM arrays to rectify BTI-induced failures by determining stability and write failures, applying elevated supply voltages for extended durations to match the drive strength of pass gates with latches, thereby improving the balance between writeability and read-stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If voltage-guard-bands are applied to compensate for BTI shifts, then reliability is improved, but device complexity and cost increase

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies controlled BTI stress to intentionally shift threshold voltages of pass gate transistors, converting the harmful BTI effect into a beneficial healing mechanism. By applying elevated voltages and temperatures, the patent induces threshold voltage shifts that compensate for previous BTI-induced imbalances, thereby improving writeability without adding complex circuitry or guard-bands

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Productivity

If minimum transistor size is used for maximum bit density, then productivity is improved, but reliability deteriorates due to increased vulnerability to BTI

Engineering Contradiction:
Improvebit densityVSAvoidreliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent dynamically changes operating parameters (voltage and temperature) to induce controlled threshold voltage shifts in pass gate transistors. By adjusting these parameters, the patent compensates for BTI-induced imbalances without changing the physical transistor dimensions, thereby maintaining high bit density while improving reliability through parameter-based compensation

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If unequal BTI effects are allowed between different elements, then ease of manufacture is improved, but reliability worsens due to imbalances between writeability and read-stability

Engineering Contradiction:
Improveease of manufactureVSAvoidwriteability and read-stability balance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies local compensation by selectively targeting specific pass gate transistors that exhibit BTI-induced imbalances. By identifying and treating only the affected transistors with controlled BTI stress, the patent restores local threshold voltage balance without requiring uniform changes across the entire device, thereby maintaining ease of manufacture while improving the writeability-read-stability balance

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces BTI-induced failures by selectively biasing targeted bits, demonstrating the potential for in-situ recovery of failing bits in SRAM arrays, reducing the need for costly voltage-guard-bands and improving overall reliability and yield.

Implementation Method 1

various methods, structures, and systems for improving the yield and/or reliability of semiconductor devices by exploitation of bias temperature instability (BTI)

Methodology Applied
Scientific EffectBias temperature instability (BTI):

Data Source

PatentUS10068660B2Methods, apparatus, and system for global healing of write-limited die through bias temperature instability
Publication Date: 2018.09.04 GLOBALFOUNDRIES US INC
  • US10068660B2 patent drawing
  • US10068660B2 patent drawing
  • US10068660B2 patent drawing

AI summary

We disclose methods, apparatus, and systems for improving semiconductor device writeability through bias temperature instability. Such a device may comprise a plurality of cells of an array, wherein each of the cells comprises a pass gate and a latch; a plurality of word lines, wherein each word line comprises a supply voltage line (VCS) which supplies voltage to each latch of a first number of cells; an array VCS driver electrically connected to each VCS; and a control line configured to provide an operational array supply voltage, a first array supply voltage, or a second array supply voltage to each VCS through the array VCS driver.