SRAM Capacitor With Finger-Shaped Electrodes

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Solution Overview

Problem

Current SRAM structures face challenges in increasing storage capacity within a limited unit area, as the size of semiconductor elements continues to shrink, necessitating innovative methods to enhance capacitor efficiency.

Innovation Solution

The SRAM structure incorporates a capacitor unit with a first electrode and a second electrode featuring S-shaped surface areas, where the first electrode has multiple protrudent portions connected to a planar portion covering the substrate surface and the second electrode has protrudent portions that protrude towards the substrate, both arranged alternately, with a dielectric layer in between, to increase surface area and storage capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the size of semiconductor elements is reduced to increase integration density, then the number of elements per unit area increases, but the storage capacity of individual capacitors decreases

Engineering Contradiction:
Improveintegration densityVSAvoidstorage capacity
Core Design Contradiction:
ProductivityVSQuantity of substance

Solution Approach 1:

The electrode structure transitions from a planar two-dimensional configuration to a three-dimensional configuration with finger-shaped protrudent portions extending vertically and laterally. This dimensional change allows the electrode to occupy additional spatial volume, increasing the effective storage capacity without expanding the horizontal footprint on the substrate, thereby resolving the contradiction between integration density and storage capacity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The capacitor structure employs nested arrangements where finger-shaped protrudent portions of the first electrode are interspersed with corresponding portions of the second electrode, creating a compact interdigitated configuration. This nesting maximizes the use of available three-dimensional space within the capacitor region, enabling increased storage capacity within the constrained horizontal area allocated for high-density integration.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Quantity of substance

If the electrode surface area is increased to enhance storage capacity, then the storage capacity increases, but the horizontal area occupied by the capacitor expands

Engineering Contradiction:
Improvestorage capacityVSAvoidhorizontal area
Core Design Contradiction:
Quantity of substanceVSArea of stationary object

Solution Approach 1:

The electrode design incorporates vertical protrudent portions that extend upward from the substrate plane, transforming the electrode from a purely two-dimensional planar structure into a three-dimensional structure. This vertical dimensionality change enables the electrode to achieve increased surface area and thus enhanced storage capacity without requiring additional horizontal area, directly addressing the contradiction between storage capacity and horizontal footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The finger-shaped protrudent portions feature curved surfaces rather than sharp edges, maximizing the surface area-to-volume ratio of the electrode structures. This curvature optimization ensures that the electrode achieves maximum storage capacity within the available three-dimensional space, preventing the need for horizontal expansion while maintaining high storage density.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Data Source

PatentUS10861858B2Static random-access memory with capacitor which has finger-shaped protrudent portions and related fabrication method
Publication Date: 2020.12.08 POWERCHIP SEMICON MFG CORP
  • US10861858B2 patent drawing
  • US10861858B2 patent drawing
  • US10861858B2 patent drawing

AI summary

A static random-access memory structure includes a substrate, a first conductive type transistor, a second conductive type transistor and a capacitor unit. The first conductive type transistor and the second conductive type transistor are disposed on the surface of the substrate, and the capacitor unit is positioned between the transistors. The capacitor unit includes a first electrode, a second electrode, and a dielectric layer disposed between the first electrode and the second electrode. The first electrode includes a plurality of first protrudent portions and a planar portion. The first protrudent portions are connected to the first planar portion and protrude from the top surface of the planar portion. The second electrode covers the top surface of the first protrudent portions and formed between adjacent first protrudent portions.