SRAM ROM Memory Reconfigurable by Substrate Polarisation
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Solution Overview
Problem
Existing memory devices struggle to integrate ROM functionality with SRAM while maintaining high integration density and avoiding substantial modifications to external control circuitry.
Innovation Solution
A microelectronic device with superimposed levels of components, featuring memory cells with cross-connected inverters and bias lines, allowing for initialization sequences that reconfigure cells between ROM and SRAM modes without modifying internal row decoders, using asymmetrical transistor polarization to impose pre-charge data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional word line is used to switch between SRAM and ROM modes, then mode reconfigurability is improved, but device complexity and control circuit modification increase
Solution Approach 1:
The patent extracts the mode selection functionality from the control circuitry and embeds it within the memory cell structure itself. By incorporating selection transistors directly in the memory cell that respond to bias line potentials, the mode switching capability is moved from external control circuits into the cell architecture, thereby reducing the need for substantial modifications to word line drivers and control logic.
Solution Approach 2:
The patent introduces bias lines as intermediary elements that mediate between the control logic and the memory cell transistors. These bias lines carry potentials that selectively activate or deactivate specific transistors within the memory cell, enabling mode switching without requiring direct modification of the existing word line control circuitry. The bias lines act as a buffer layer that simplifies the interface between control logic and cell operation.
2Adaptability or versatility
If ROM functionality is integrated with SRAM cells, then memory versatility is improved, but integration density decreases
Solution Approach 1:
The patent merges ROM and SRAM functionalities into a unified memory cell structure. The same physical memory cell can operate in either SRAM mode (with all transistors active) or ROM mode (with selection transistors activating specific paths), eliminating the need for separate ROM and SRAM cell structures. This consolidation maintains high integration density while providing dual functionality.
Solution Approach 2:
The memory cell is designed with universal transistors that can serve multiple functions depending on bias conditions. The selection transistors, when activated by specific bias line potentials, enable the cell to function as a ROM cell with predetermined data, while in other bias states the same cell operates as a fully writable SRAM cell. This multi-functionality approach maximizes memory versatility without sacrificing integration density.
3Ease of manufacture
If fixed transistor polarization is used during manufacture, then manufacturing simplicity is improved, but reconfigurability deteriorates
Solution Approach 1:
The patent introduces dynamic polarization control through bias lines that can change transistor operating states after manufacture. The selection transistors respond to time-varying potentials on the bias lines, allowing the memory cell to dynamically switch between SRAM and ROM modes. This dynamic control is implemented using standard transistor structures and biasing techniques that are compatible with conventional manufacturing processes, maintaining manufacturing simplicity while enabling post-manufacture reconfigurability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of memory cells as both ROM and SRAM without altering internal control circuits, increasing integration density and allowing for automatic mode switching based on cell connections to bias lines.
Implementation Method 1
having each a lower electrode located between the second semiconductor layer and the first semiconductor layer and coupled by capacitance coupling with a channel region located in the second semiconductor layer
Data Source
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AI summary
3D microelectronic device with several superimposed levels (N1, N2) of components with a higher level (N2) comprising one or more memory cells having an SRAM structure and having a back polarization electrode whose polarization is modified to switch the cells from a ROM mode of operation to an SRAM mode of operation (Figure 2).