SSD Encapsulating Colloid Isolating Electronic Circuit
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Solution Overview
Problem
In traditional SSD encapsulation methods, circuit components are directly exposed, leading to dampness and contamination by dust, resulting in unstable functionality.
Innovation Solution
A Solid-State Drive (SSD) storage module with an encapsulating colloid that seamlessly covers the electronic circuit on a printed circuit board, featuring metal contact pieces for electrical connections, including SATA interface contact pieces, and a separation slot for component assembly, which isolates the circuit from air exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If circuit components are directly exposed in the air for SSD encapsulation, then the encapsulation structure is simple, but the circuit components are prone to dampness and dust contamination, resulting in unstable functionality
Solution Approach 1:
The patent applies a planar encapsulating layer (thin film) formed by photolithography and etching processes to cover the circuit components on the PCB board. This thin film encapsulation protects the circuit components from dampness and dust contamination while maintaining a relatively simple structure, resolving the contradiction between reliability improvement and device complexity
Solution Approach 2:
The encapsulating layer creates a protected environment that isolates circuit components from the external air atmosphere, preventing exposure to harmful environmental factors such as moisture and dust. This effectively creates an inert protective barrier that enhances functionality stability without requiring complex encapsulation structures
2Reliability
If circuit components are directly exposed in the air, then the manufacturing process is simple, but the circuit components are prone to contamination, affecting performance
Solution Approach 1:
The patent uses a planar encapsulating layer formed through standard photolithography and etching processes to protect circuit components. While this adds manufacturing steps compared to direct exposure, it provides effective protection against contamination and maintains component performance, achieving a balance between ease of manufacture and reliability
Solution Approach 2:
The encapsulating layer is formed before final assembly and testing, creating a protective barrier in advance that prevents contamination during subsequent handling and operation. This preliminary encapsulation action ensures component performance is protected from the outset, justifying the additional manufacturing complexity
Data Source
AI summary
A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.