SSD Package With Connection Substrate Cavity
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Solution Overview
Problem
The existing solid state drive (SSD) technology faces challenges in reducing size and minimizing development time and cost, as traditional SSDs are larger and more resource-intensive compared to hard disk drives.
Innovation Solution
The proposed SSD package design incorporates an integrated circuit substrate with a controller chip, buffer memory chip, and multiple memory chips connected via redistribution layers and a connection substrate, allowing for a compact and efficient configuration that reduces size and enhances memory capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional SSD package design is used, then memory capacity can be achieved, but the size of the SSD package becomes large
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration by placing the controller chip and buffer memory chip vertically above the connection substrate. This vertical stacking enables multiple memory chips to be arranged in layers, significantly increasing storage capacity within a reduced footprint area.
Solution Approach 2:
The connection substrate with cavity structure allows the controller chip and buffer memory chip to be nested within the recessed area, creating a compact hierarchical arrangement where smaller components are positioned within the structural envelope of larger components, optimizing space utilization.
2Quantity of substance
If more memory chips are added to increase capacity, then storage increases, but the package area expands
Solution Approach 1:
The patent resolves this contradiction by exploiting the third dimension (vertical height) to accommodate multiple memory chips in stacked layers rather than spreading them horizontally. The connection substrate's cavity structure and redistribution layers enable this vertical integration, allowing high capacity within a compact area.
Solution Approach 2:
The package is segmented into functional layers: connection substrate at the base, controller chip and buffer memory chip in the cavity, and multiple memory chips stacked above. This segmentation allows independent optimization of each layer while achieving high overall density.
3Adaptability or versatility
If complex connection structures are used to connect multiple chips, then functionality is achieved, but manufacturing complexity increases
Solution Approach 1:
The connection substrate serves as an intermediary component that simplifies the connection architecture. It provides a centralized platform with cavity structures and redistribution layers that mediate between the controller chip, buffer memory chip, and multiple memory chips, reducing the need for complex direct interconnections between all components.
Solution Approach 2:
The connection substrate performs multiple functions simultaneously: it provides mechanical support, electrical interconnection through redistribution layers, structural housing for the cavity, and alignment reference for chip placement. This multi-functionality reduces the need for additional specialized components.
Data Source
AI summary
A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; and a plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.