Aircraft SSPC PCB Potting Structure for Heat and Space Constraints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Aircraft solid state power controllers (SSPCs) face challenges in efficiently managing heat generation and space utilization due to the separate power chip packages for individual power switches, which increase space requirements and limit power density while requiring robust heat dissipation and mechanical stability.
Innovation Solution
A printed circuit board assembly with a single insulating potting covering heat-generating electronic components, forming a monolithic configuration that enhances mechanical stability and heat dissipation, and allows for compact, stacked board assemblies with coordinated three-dimensional structures and clamping mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate power chip packages are used for individual power switches, then heat generation per switch is kept below critical thresholds, but space requirements increase and power density is limited
Solution Approach 1:
The patent merges multiple separate power chip packages into a single integrated power chip module that contains multiple power switches. This consolidation reduces the total number of discrete packages needed on the PCB, thereby decreasing space requirements and increasing power density while maintaining effective heat management through the unified module structure.
2Temperature
If separate power chip packages are used for individual power switches, then heat dissipation can be managed per switch, but mechanical stability and assembly complexity increase
Solution Approach 1:
By integrating multiple power switches into a single power chip module, the patent reduces the number of separate assembly operations required. Instead of individually mounting and securing multiple discrete power chip packages, the unified module is installed as one unit, simplifying the assembly process and improving mechanical stability.
3Temperature
If multiple separate power chip packages are mounted on PCB, then individual heat management is achieved, but power density is reduced
Solution Approach 1:
The patent consolidates multiple power switches into a single integrated module, which increases the number of power switches that can be accommodated in a given PCB area. This higher concentration of power switches within a compact footprint directly increases power density while the modular design maintains effective heat management for each switch.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, mechanically stable, and efficient heat-dissipating circuit board assembly that reduces the need for external cooling measures, improves electromagnetic compatibility, and optimizes space utilization in aircraft SSPCs.
Implementation Method 1
an insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side
Data Source
AI summary
A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.