Stack Semiconductor Package Heat Dissipation Member
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Solution Overview
Problem
Current stack type semiconductor packages face inefficiencies in heat dissipation due to air gaps between the lower and upper semiconductor packages, which hinder effective heat transfer and lead to overheating issues.
Innovation Solution
The implementation of a heat dissipation member on the lower semiconductor chip and an interconnection unit on the upper package substrate, which facilitates thermal conduction and dissipation of heat generated by the lower chip to the upper package, eliminating air gaps and enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a stack type semiconductor package is used to increase integration density, then the degree of integration is improved and device size is reduced, but air gaps between packages cause heat dissipation efficiency to deteriorate
Solution Approach 1:
A heat dissipation member is introduced as an intermediary component between the lower semiconductor chip and the upper package substrate. This mediator fills the air gap and provides a thermal conduction path, allowing heat to be effectively transferred from the lower chip through the interconnection unit to the upper package substrate, thereby resolving the heat dissipation problem while maintaining the stacked configuration
Solution Approach 2:
The heat dissipation member is formed using composite material structure, including a metal pattern layer deposited on an insulating layer. This composite structure provides both thermal conduction capability through the metal pattern and electrical insulation through the insulating layer, enabling effective heat dissipation while preventing electrical short circuits in the stacked package
2Temperature
If a heat dissipation member is added to improve heat transfer, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation member is merged with the interconnection structure by forming the metal pattern and insulating layer directly on the interconnection unit. This integration approach combines the heat dissipation function with the existing electrical connection structure, adding thermal management capability without significantly increasing overall device complexity
Solution Approach 2:
The heat dissipation member serves multiple functions simultaneously: it provides thermal conduction to dissipate heat, maintains electrical insulation between stacked packages, and structurally fills the gap between the lower chip and upper substrate. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, reduces the risk of overheating, and enhances the reliability and durability of the semiconductor package by ensuring effective heat transfer from the lower chip to the upper package.
Implementation Method 1
heat generated in the lower semiconductor chip is transferred through the heat dissipation member and the interconnection unit to the upper semiconductor package
Data Source
AI summary
A stack type semiconductor package includes: a lower semiconductor package including a lower package substrate, and a lower semiconductor chip which is mounted on the lower package substrate and includes a first surface facing a top surface of the lower package substrate and a second surface opposite to the first surface; an upper semiconductor package including an upper package substrate and an upper semiconductor chip which is mounted on the upper package substrate; an inter-package connection unit which connects the lower package substrate and the upper package substrate; a heat dissipation member which is formed on the second surface of the lower semiconductor chip; and an interconnection unit which is formed on a bottom surface of the upper package substrate, and is adhered to the heat dissipation member to connect the lower semiconductor chip and the upper package substrate.