Stack Structure Manufacturing Using Integrated Lead Frame Connection Ribs
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Solution Overview
Problem
Conventional stack structures of integrated power modules face challenges such as complex production procedures, high production costs, and poor connection strength between modules, leading to reliability issues in power supply systems.
Innovation Solution
A stack structure is developed using at least two modules with a metal connection component integrated into a lead frame, where the modules are connected via a metal connection component with a first end connected to one module and a second end to the other, and packaged with molding compound for enhanced reliability and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional stack structures are used with separate integrated modules adhered by adhesive layers, then module connection is achieved, but the production procedure becomes complex and production cost increases
Solution Approach 1:
The patent merges the connection function into the lead frame structure itself by designing connection ribs that extend from the lead frame body. These connection ribs directly connect to corresponding pins of stacked modules, eliminating the need for separate adhesive layers and external connection components. The lead frame simultaneously serves as both the electrical connection carrier and the mechanical support structure, simplifying the production procedure while maintaining reliable connections.
2Reliability
If multiple discrete semiconductor devices are used in power converter, then device functionality is achieved, but space utilization ratio becomes extremely low
Solution Approach 1:
The patent integrates multiple semiconductor devices (power chips, control chips, passive components) onto a single lead frame structure. The lead frame serves as a common substrate that electrically and mechanically connects all devices, replacing traditional discrete mounting methods. This integration significantly improves space utilization ratio while maintaining full device functionality and enabling compact stack structure formation.
3Reliability
If modules are connected by welding or adhering corresponding pins, then electrical connection is established, but connection strength is poor and reliability is reduced
Solution Approach 1:
The patent combines electrical connection and mechanical support functions into a single integrated lead frame structure. The connection ribs of the lead frame directly contact the pins of stacked modules, providing both electrical conductivity and mechanical strength simultaneously. This eliminates the weakness of separate welding or adhering methods, as the rigid lead frame structure inherently provides strong mechanical support while maintaining reliable electrical connection.
Data Source
AI summary
A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.