Stackable Semiconductor Die with Unified Mask Contacts
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Solution Overview
Problem
Existing die systems face limitations in design flexibility and ease of stacking due to the need for different masks for upper and lower faces, leading to cumbersome management and restricted connectivity between dies.
Innovation Solution
The die features upper and lower contacts, including non-connected and connected types, along with conductive elements that connect corresponding contacts across faces, allowing for easy stacking and elimination of the need for jumpers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different masks are used to make different layouts on upper and lower faces of a die, then the contacts and layout can be customized for different contacts and layouts, but the management of the masks becomes troublesome and the design of the die system becomes limited
Solution Approach 1:
The patent applies universality by making the upper mask and lower mask identical, allowing each mask to serve multiple functions for both upper and lower face contacts. This single mask design can be reused for different die orientations and stacking configurations, eliminating the need to manage separate masks for each face and enabling versatile die system design without increasing mask management complexity
Solution Approach 2:
The patent merges the functionality of separate upper and lower masks into a single unified mask design. By combining the contact pattern definitions for both faces into one mask, the system reduces the number of mask components that need to be managed while maintaining the ability to create different contact layouts through stacking variations
2Reliability
If wires are used to connect the contacts of each die to the contacts of another die after stacking, then connectivity between dies can be achieved, but the design flexibility and ease of stacking are limited
Solution Approach 1:
The patent applies preliminary action by pre-configuring the contact patterns on the die faces during the manufacturing process using the unified mask. The contacts are arranged in advance to enable direct stacking without requiring subsequent wire connections, thereby maintaining reliability of connectivity while significantly improving ease of stacking and design flexibility
Solution Approach 2:
The patent extracts the need for wire connections by designing the die contacts to interface directly with each other through precise stacking. This removes the additional complexity of wire bonding or other post-stack connection methods, allowing dies to be stacked easily while maintaining reliable electrical connectivity through the pre-configured contact interfaces
Data Source
AI summary
A die includes upper contacts, lower contacts and conductive elements. The upper contacts are formed on an upper face of the die. The upper contacts include a non-connected upper contact and connected upper contacts. The lower contacts are formed on a lower face of the die. The lower contacts include a non-connected lower contact and connected lower contacts. Each of the conductive elements connects a related one of the connected upper contacts to a related one of the connected lower contacts.