Stackable IC Package Connector Lead Design

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Solution Overview

Problem

Current Package On Package (POP) solutions fail to provide simplified manufacturing processing, smaller dimensions, lower costs, design flexibility, and increased electrical wire connectivity capabilities, which are critical for competitive high-performance electronic products.

Innovation Solution

The integration of connector leads with a protruded connection surface and a lowered structure, allowing for enhanced connectivity and structural rigidity between the package die and substrate, enabling improved electrical connectivity and flexibility in integrated circuit package systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional POP solutions are used, then manufacturing processing is simplified, but electrical wire connectivity capabilities are insufficient

Engineering Contradiction:

Improvemanufacturing processingVSAvoidelectrical wire connectivity capabilities

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The connector lead is segmented into distinct functional zones: a body portion for structural support, a protruded connection surface for electrical contact, and a lowered structure for mechanical engagement. This segmentation allows each portion to be optimized independently, enabling both simplified manufacturing and enhanced connectivity capabilities.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The connector lead extends in multiple spatial dimensions with the protruded connection surface projecting upward and the lowered structure extending downward. This multi-dimensional configuration increases electrical wire connectivity capabilities while maintaining a compact form factor suitable for simplified POP manufacturing processes.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If package dimensions are reduced, then small form factor is achieved, but structural rigidity decreases

Engineering Contradiction:

Improvepackage dimensionsVSAvoidstructural rigidity

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The connector lead employs a composite structure combining the protruded connection surface and lowered structure in a single integrated component. This composite design provides enhanced structural rigidity within reduced package dimensions, as the multi-zone configuration creates structural reinforcement without increasing overall volume.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The connector lead features curved and contoured surfaces including the protruded connection surface and lowered structure, which provide structural strength through geometric optimization. These curved configurations maintain rigidity while minimizing material usage and package footprint.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Ease of manufacture

If connector lead structure is simplified, then manufacturing costs are reduced, but connectivity and signal quality deteriorate

Engineering Contradiction:

Improvemanufacturing costsVSAvoidsignal quality

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The connector lead serves multiple functions simultaneously: the protruded connection surface provides electrical connectivity, the lowered structure provides mechanical engagement and positioning, and the body portion provides structural support and signal transmission. This multi-functionality achieves enhanced signal quality and connectivity without requiring multiple separate components, thereby controlling manufacturing costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8067307B2Integrated circuit package system for stackable devices

Publication Date: 2011.11.29 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.