Stackable Semiconductor Package Using Double Side Mold Modules
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Solution Overview
Problem
The existing semiconductor package structures, such as package-in-package (PiP) systems, face challenges in increasing device packing density due to the space requirements of dummy spacers, which reduce the available headroom and hinder the integration of more semiconductor devices.
Innovation Solution
The implementation of a double side mold (DSM) internal stacking module (ISM) system, where semiconductor dies are directly attached to each other and a substrate using adhesives, eliminating the need for dummy spacers and allowing for increased packing density by reducing the package height and size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If dummy spacers are used to separate semiconductor die and ISM, then structural support is provided, but package headroom is reduced and packing density decreases
Solution Approach 1:
The patent removes the dummy spacer component entirely from the package structure. Instead of using a separate spacer element, the ISM substrate itself provides the necessary structural support and spacing function, eliminating the need for dedicated dummy spacers and thereby increasing packing density.
Solution Approach 2:
The ISM substrate serves multiple functions simultaneously: it provides structural support, acts as a mounting platform for semiconductor die, provides electrical connectivity through solder balls, and maintains proper spacing between components. This multi-functionality eliminates the need for separate dummy spacer components.
2Strength
If dummy spacers are used for separation, then structural support is maintained, but package size and dimensions increase
Solution Approach 1:
The dummy spacer is extracted from the package structure, reducing the overall package dimensions. The ISM substrate assumes the structural support role, allowing for a more compact package design without compromising structural integrity.
3Ease of manufacture
If traditional PiP structure with dummy spacers is used, then manufacturing process is straightforward, but manufacturing cost increases and yield decreases
Solution Approach 1:
Removing the dummy spacer simplifies the manufacturing process by reducing the number of components and assembly steps. Fewer components mean fewer potential failure points, leading to improved manufacturing yield and reduced costs.
4Quantity of substance
If more semiconductor devices are integrated, then device capability increases, but package headroom requirements increase
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking architecture. Multiple semiconductor devices are arranged in vertical layers (ISM stacked above substrate), utilizing the vertical dimension to increase device integration without proportionally increasing package footprint or headroom requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances semiconductor device packing density, reduces package size, and enables flexible integration configurations while maintaining low manufacturing costs and improved yield.
Implementation Method 1
The DSM ISM is attached to the semiconductor die with an adhesive
Data Source
AI summary
A semiconductor package has a substrate with solder balls. A first semiconductor die is disposed on the substrate. A first double side mold (DSM) internal stackable module (ISM) is in physical contact with the first semiconductor die through a first adhesive, such as a film on wire adhesive. A second DSM ISM is in physical contact with the first DSM ISM through a second adhesive. The arrangement of the first and second DSM ISM reduce headroom requirements for the package and increase device packing density. Each DSM ISM has semiconductor die disposed in cavities. An interposer is disposed above the top DSM ISM. Wire bonds connect the semiconductor die and DSM ISMs to the solder balls. An encapsulant surrounds the first semiconductor die and first DSM ISM with an exposed mold area in the encapsulant above the interposer.