Stacked Amplifier Package With RDL for Compact Impedance Matching
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Solution Overview
Problem
The use of bond wires to electrically connect GaN-based and/or GaAs-based amplifier circuits with Si-based control circuits increases the device area and package size, and existing impedance matching circuits are inefficient, leading to performance issues.
Innovation Solution
An electronic package design where the control component is disposed above the amplifier component, with a first circuit layer separating them, and pre-formed connection components are used to reduce device area and improve impedance matching, utilizing a redistribution layer (RDL) for signal transmission and heat dissipation paths defined by thermal pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond wires are used to electrically connect the control circuit and the leadframes, then electrical connection is achieved, but the device area or footprint of the package increases
Solution Approach 1:
The patent extracts the function of electrical connection from traditional bond wires and relocates it to conductive vias formed within the circuit layer. This removes the need for bond wires extending across the package surface, thereby reducing device area while maintaining electrical connectivity between the control circuit and amplifier circuit.
Solution Approach 2:
The circuit layer acts as an intermediary between the control circuit and amplifier circuit, providing both mechanical support and electrical connection pathways through integrated conductive vias. This intermediary structure eliminates the need for separate bond wires and leadframes, reducing overall package footprint.
2Area of stationary object
If amplifier circuits are stacked over control circuits to reduce package size, then package size is reduced, but bond wires are required which increase device area
Solution Approach 1:
The patent merges the functions of mechanical support, electrical connection, and signal transmission into a single integrated circuit layer structure. The conductive vias within the circuit layer combine structural and electrical functions, eliminating the need for separate bond wires and reducing package size without compromising electrical connectivity.
Solution Approach 2:
The circuit layer serves multiple functions simultaneously: it provides mechanical support for stacked components, establishes electrical connections through conductive vias, and enables signal transmission between layers. This multi-functionality reduces the need for additional components like bond wires, thereby reducing package size.
3Reliability
If traditional impedance matching circuits are used, then signal transmission is achieved, but impedance matching performance is inefficient
Solution Approach 1:
The patent implements localized impedance control by forming specific conductive via patterns and configurations within the circuit layer at critical signal transmission points. This local optimization of conductive structures provides effective impedance matching without requiring complex traditional matching circuits, thereby improving performance while maintaining manufacturing simplicity.
Data Source
AI summary
An electronic package is provided. The electronic package includes an amplifier component, a control component, and a first circuit layer. The control component is disposed above the amplifier component. The first circuit layer is disposed between the amplifier component and the control component. The control component is configured to transmit a first signal to the amplifier component and to output a second signal amplified by the amplifier component.