Stacked CFET Gate Liner Layout for Independent Gates

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Solution Overview

Problem

Conventional complementary field effect transistors (CFETs) face challenges in achieving independent gates and reducing metal volume to lower parasitic capacitance, particularly in stacked nanosheet configurations.

Innovation Solution

A semiconductor structure is designed with a second nanosheet device stacked over a first nanosheet device, where each nanosheet has a side contacting a dielectric material and a functional gate-containing liner, and sacrificial liners are replaced with functional gate structures, forming independent gates and reducing metal volume.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional CFET stacking is used to achieve smaller scale devices, then device miniaturization is improved, but independent gate control becomes difficult to achieve

Engineering Contradiction:
Improvedevice sizeVSAvoidindependent gate control
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

The patent divides the CFET structure into separate n-type and p-type nanosheet stacks, each with its own independent gate structure. This segmentation allows each transistor type to have dedicated gate control while maintaining compact vertical stacking, resolving the contradiction between miniaturization and independent gate control.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar gate control to vertical stacking with gate-all-around structures. By utilizing the vertical dimension for stacking multiple nanosheets and implementing gates that wrap around channels in three dimensions, the patent achieves both small device footprint and independent gate control through spatial reconfiguration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If conventional CFET gate structure is used, then device functionality is achieved, but large gate metal volume causes high parasitic capacitance

Engineering Contradiction:
Improvedevice functionalityVSAvoidparasitic capacitance
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the physical parameters of the gate structure by implementing thinner gate metal layers and optimizing gate material composition. These parameter changes reduce gate metal volume while maintaining sufficient gate control over the channel, thereby reducing parasitic capacitance without sacrificing device functionality.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite gate structures combining multiple materials with different properties (e.g., high-k dielectric materials with metal gates). This composite approach enables effective gate control with reduced metal volume, lowering parasitic capacitance while preserving essential device functionality.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12513985B2CFET with independent gate control and low parasitic capacitance
Publication Date: 2025.12.30 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US12513985B2 patent drawing
  • US12513985B2 patent drawing
  • US12513985B2 patent drawing

AI summary

A semiconductor structure is provided that includes a second nanosheet device of a second conductivity type stacked over a first nanosheet device of a first conductivity type that is different from the second conductivity type. Each of the first and second nanosheet devices includes at least one semiconductor channel material nanosheet. One side of the least one semiconductor channel material nanosheet of both the first and second nanosheet devices contacts a dielectric material, while another side of the least one semiconductor channel material nanosheet of both the first and second nanosheet devices contacts a functional gate-containing liner that extends laterally to connect to a gate contact of each first and second nanosheet device.