Stacked Light-Emitting Chip Layout for Higher Display Resolution

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Solution Overview

Problem

Current Mini LED and Micro LED displays face limitations in resolution due to the space required for parallel arrangement of light-emitting elements and driver circuits, which hinders further improvement in display panel resolution.

Innovation Solution

The display panel incorporates a substrate with stacked light-emitting chips, where each chip includes a light-emitting element and a driver circuit, allowing for both light-emitting and driving functions, reducing the need for separate driver circuits on the substrate and optimizing space utilization by arranging the light-emitting chips in a stacked configuration with varying orthographic projection areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If light-emitting elements and driver circuits are arranged in parallel on the substrate, then the structure is simple and easy to manufacture, but the resolution of the display panel is limited due to space requirements

Engineering Contradiction:
Improvedisplay panel resolutionVSAvoidstacked light-emitting chip structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent transitions from a two-dimensional parallel arrangement of light-emitting elements and driver circuits on the substrate to a three-dimensional stacked configuration. Multiple light-emitting chips are stacked vertically, with driver circuits integrated within each chip layer, thereby utilizing the vertical dimension to increase pixel density and resolution without proportionally increasing the horizontal footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines the light-emitting element and driver circuit into a single integrated light-emitting chip structure. The driver circuit is formed on the same substrate as the light-emitting element, and they are electrically connected through conductive structures, eliminating the need for separate driver circuit regions and reducing overall space requirements.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of operation

If separate driver circuits are provided on the substrate for each light-emitting element, then each element can be independently controlled, but the wiring space increases and reduces space efficiency

Engineering Contradiction:
Improveindependent control of light-emitting elementsVSAvoidwiring space
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The driver circuit and light-emitting element are merged into a single integrated chip structure. The driver circuit is formed on the same substrate as the light-emitting element, with conductive structures providing electrical connections between them, thereby eliminating separate wiring regions and reducing overall space requirements while maintaining independent control capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The driver circuit is nested within the light-emitting chip structure. The conductive structures are formed within the same vertical space as the light-emitting element, with the driver circuit occupying the lower portion and the light-emitting element occupying the upper portion, thereby achieving space-efficient integration.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Manufacturing precision

If multiple light-emitting chips are stacked with varying orthographic projection areas, then space utilization is optimized and resolution is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvedisplay panel resolutionVSAvoidstacked chip assembly process
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent utilizes vertical stacking of multiple light-emitting chips with different orthographic projection areas to increase pixel density. The varying sizes of adjacent chips are arranged in the vertical dimension, allowing for optimized space utilization and higher resolution without requiring complex lateral patterning processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the resolution of the display panel by reducing wiring space and improving space efficiency, allowing for higher density and performance in light-emitting elements while maintaining effective light emission and driving capabilities.

Implementation Method 1

Light-emitting diode (LED) is a semiconductor element that can convert current into light within a specific wavelength range. The light emission principle is that an energy difference of electrons moving between N-type and P-type semiconductors is released in the form of light.

Methodology Applied
Scientific EffectLight emission from LED: Light Emitting Diode

Data Source

PatentUS20240014366A1Display panel and display apparatus
Publication Date: 2024.01.11 TIANMA ADVANCED DISPLAY TECH INST (XIAMEN) CO LTD
  • US20240014366A1 patent drawing
  • US20240014366A1 patent drawing
  • US20240014366A1 patent drawing

AI summary

A display panel including a substrate including signal lines, and a light-emitting element group located at a side of the substrate and electrically connected to the signal lines. The light-emitting element group includes light-emitting chips, each including a light-emitting element and a driver circuit that are stacked. The driver circuit is used to drive the light-emitting element to emit light. The light-emitting chips include at least a first light-emitting chip located at the side of the substrate and a second light-emitting chip located at a side of the first light-emitting chip adjacent to the substrate. An orthographic projection area of the second light-emitting chip is smaller than that of the first light-emitting chip in a first direction, and the first direction is perpendicular to a plane of the substrate.