Stacked Circuit Board Module for High-Frequency Signal Integrity
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Solution Overview
Problem
High-frequency signals on circuit boards experience stub effects due to passing through multiple conductive holes, leading to reflected waves and signal integrity issues.
Innovation Solution
A circuit board module design comprising a first circuit board with two conductive layers and a dielectric core layer, connected by conductive holes, and a second circuit board with similar layers, bonded via a connection layer, limiting high-frequency signal transmission to the first board to reduce stub effects and signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If high-frequency signals pass through multiple conductive holes for transmission, then signal transmission distance is extended, but stub effects occur causing reflected waves and signal integrity degradation
Solution Approach 1:
The patent extracts the high-frequency signal transmission path from the conventional multi-hole through-path and confines it to a single microstrip line on the first circuit board. By taking out the signal path from the problematic multi-hole transmission route and placing it on a dedicated microstrip line structure, the stub effects and reflected waves are eliminated while maintaining transmission distance through the stacked board configuration.
Solution Approach 2:
The patent transitions from planar signal transmission to three-dimensional stacked board transmission. By utilizing the vertical dimension with multiple circuit boards stacked and connected via connection layers, the signal can achieve longer transmission distance without passing through multiple conductive holes in series. The microstrip line on the first circuit board combined with the connection layer structure provides a new dimensional path for signal transmission.
2Ease of manufacture
If conventional circuit board structures with multiple conductive holes are used, then manufacturing is simplified, but impedance matching becomes complex and signal loss increases
Solution Approach 1:
The patent applies local quality by creating a specialized microstrip line structure on the first circuit board with specific impedance control. Instead of using uniform conventional trace structures throughout, the high-frequency signal path is given a dedicated microstrip line design with controlled impedance characteristics. This local optimization reduces signal loss and simplifies impedance matching at the critical transmission points while maintaining conventional manufacturing for other parts of the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal transmission loss, simplifies impedance matching, and maintains signal integrity by minimizing conductive holes, making it suitable for high-frequency applications like 5G and millimeter wave products.
Implementation Method 1
the first prepreg connection layer is cured to form a first connection layer after being heated
Data Source
AI summary
A circuit board module includes a first circuit board, a second circuit board and a connection layer. The first circuit board includes two first conductive layers, a first dielectric core layer and a first conductive via, the first dielectric core layer is formed between the two first conductive layers, and the first conductive via connects the two first conductive layers. The second circuit board includes two second conductive layers, a second dielectric core layer and a second conductive via, the second dielectric core layer is formed between the two second conductive layers, and the second conductive via connect the two second conductive layers. The connection layer is formed between the first circuit board and the second circuit board and combines the first circuit board with the second circuit board. The second circuit board is disposed on a side of the first circuit board.