Stacked Coil Component with Via-Connected Patterns

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Solution Overview

Problem

There is a growing demand for power inductors that offer high current efficiency, high performance, small size, and small thickness, particularly for multi-terminal power inductors where multiple inductances need to be implemented in a single chip.

Innovation Solution

A coil component design featuring a body with stacked coil patterns electrically connected through vias, external electrodes, and a support member, where the core center is filled with encapsulant, allowing for multiple inductances to be integrated in a single chip, with optional dummy electrodes for balance and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multiple inductances are implemented in a single chip, then the quantity of inductances increases, but the device complexity increases

Engineering Contradiction:
Improvenumber of inductancesVSAvoidstructural complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The coil structure is divided into multiple coil patterns (first coil pattern, second coil pattern, third coil pattern) that are stacked in the thickness direction. Each coil pattern can be independently connected to external electrodes, enabling multiple inductances to be implemented by segmenting the single chip into functional layers.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar coil arrangements to three-dimensional stacked coil patterns in the thickness direction. This dimensional change allows multiple inductances to be integrated vertically within the same chip footprint, increasing the number of inductances without proportionally increasing the chip area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If coil patterns are stacked in the thickness direction, then the area occupied by coils decreases, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvechip areaVSAvoidalignment precision
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

A support member is introduced as an intermediary structure between the stacked coil patterns. The support member provides mechanical support and positional reference, facilitating precise alignment of the coil patterns in the thickness direction during manufacturing processes.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The support member is formed in advance to define the positional relationship between coil patterns before the coil patterns are fully assembled. This preliminary structuring establishes alignment references that guide subsequent manufacturing steps, reducing the difficulty of achieving precise alignment.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If vias are used to electrically connect stacked coil patterns, then the electrical connectivity increases, but the manufacturing complexity increases

Engineering Contradiction:
Improveelectrical connectivityVSAvoidprocess complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The support member serves multiple functions: it provides mechanical support for the stacked coil patterns, acts as a template for via formation, and facilitates electrical connectivity between layers. This multi-functionality reduces the need for separate process steps and simplifies the overall manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11170927B2Coil component
Publication Date: 2021.11.09 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11170927B2 patent drawing
  • US11170927B2 patent drawing
  • US11170927B2 patent drawing

AI summary

A coil component includes: a body including a coil and an encapsulant encapsulating the coil; and an external electrode disposed on an external surface of the body, wherein a core center of the coil is filled with the encapsulant, the coil includes a plurality of coil patterns connected to each other by a via, the plurality of coil patterns have a stacked structure in which the plurality of coil patterns are stacked in one direction, and the external electrode includes a first external electrode, a second external electrode, and a third external electrode disposed to be spaced apart from one another.