Stacked 2D and Depth Image Sensor Layout for Pixel Alignment
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Solution Overview
Problem
Existing image acquisition devices that simultaneously capture 2D visible and depth images often suffer from misalignment and increased size and cost due to separate image sensors with different viewpoints.
Innovation Solution
A device is manufactured with a first sensor for depth pixels and a second sensor for 2D image pixels on opposite faces of a semiconductor substrate, with optical concentrators between them, allowing for simultaneous acquisition of both image types on a single integrated platform.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate image sensors are placed side by side to acquire 2D and depth images simultaneously, then both images can be captured, but misalignment between pixels occurs and device size and cost increase
Solution Approach 1:
The patent merges the depth sensor and 2D image sensor into a single integrated sensor unit. The depth pixels and 2D image pixels are formed on the same semiconductor substrate, sharing common structures such as microlenses and signal processing circuits. This integration eliminates the need for separate sensors placed side by side, thereby reducing device size and cost while maintaining simultaneous acquisition capability.
Solution Approach 2:
The integrated sensor performs multiple functions using shared components. The same semiconductor substrate, microlenses, and readout circuits serve both depth measurement and 2D image capture functions. This multi-functionality reduces the overall device complexity and cost while enabling simultaneous acquisition of both image types.
2Productivity
If separate image sensors are placed side by side to acquire 2D and depth images simultaneously, then both images can be captured, but alignment between corresponding image pixels deteriorates
Solution Approach 1:
By merging depth pixels and 2D image pixels onto the same semiconductor substrate, the patent ensures that corresponding pixels are physically co-located. This eliminates the alignment issues that arise when separate sensors are placed side by side, as the integrated design guarantees precise spatial correspondence between depth and 2D image pixels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces device size and cost while enabling precise alignment and efficient radiation transmission, optimizing the capture of both 2D and depth images.
Implementation Method 1
at least one optical concentrator formed in the first support substrate, on the side of a second face of the first support substrate opposite the first face
Implementation Method 2
each optical concentrator is a refractive microlens, a diffractive microlens, a Fresnel microlens, or a metasurface
Data Source
AI summary
A method of manufacturing a device for acquiring a 2D image and a depth image, the method comprising the following steps: a) forming, on a first face of a first support semiconductor substrate, a first sensor comprising a plurality of depth pixels; b) forming, in the first support substrate, on the side of a second face of the first substrate opposite the first face, at least one optical concentrator; c) forming, in and on a second semiconductor substrate, a second sensor comprising a plurality of 2D image pixels; and d) placing the second sensor right next the first support substrate on the side of the second face of the first support substrate.