Stacked Die Hybrid Copper Bonding for Heat and Structural Support
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Solution Overview
Problem
The thermal conductivity and structural support between components of semiconductor packages become challenging as they increase in capability and complexity, particularly with stacked dies, necessitating improved methods for thermal dissipation and mechanical support.
Innovation Solution
A method involving hybrid copper bonding with face-to-face coupling of interconnecting layers, dielectric layers, and copper pads, combined with a support die and microbumps, to enhance thermal conductivity and structural support, using materials like silicon oxide and microfluidic channels for active cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If stacked dies are used to increase interconnect density, then signal bandwidth and processing capability are improved, but thermal conductivity and structural support become more difficult to manage
Solution Approach 1:
The support die is designed to perform multiple functions simultaneously: it provides mechanical support to maintain alignment of stacked dies, conducts thermal heat dissipation from the stacked dies, and serves as a structural platform for mounting the die stack. This multi-functional approach resolves the contradiction by integrating thermal management and structural support into a single component rather than requiring separate systems for each function.
Solution Approach 2:
The support die acts as an intermediary component between the stacked dies and the substrate. It receives thermal energy from the stacked dies through thermal conduction and provides mechanical support to the die stack, mediating the thermal and mechanical interactions in the package structure.
2Productivity
If stacked dies are used to increase interconnect density, then processing capability is improved, but structural support between components becomes more difficult to manage
Solution Approach 1:
The support die provides multiple functions including mechanical support for the stacked dies, thermal conduction pathway, and structural platform for mounting. By integrating these functions into a single component, the patent resolves the structural support challenge while maintaining the high processing capability enabled by die stacking.
Solution Approach 2:
The support die is designed with specific material properties and geometric parameters (thickness, area, thermal conductivity) that can be optimized to provide adequate mechanical support strength while maintaining thermal management capabilities. By carefully controlling these parameters, the structure can support the stacked dies without compromising structural integrity.
3Reliability
If hybrid copper bonding is used to meet signal bandwidth requirements, then interconnect performance is improved, but manufacturing process complexity increases
Solution Approach 1:
The support die serves as a multi-functional platform that simultaneously provides mechanical support, thermal management, and electrical interconnection capabilities. By integrating these functions into a single component rather than requiring separate systems, the patent reduces overall manufacturing complexity while maintaining high signal bandwidth performance through the hybrid copper bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conductivity and structural support, allowing for higher power density, durability, and efficiency in semiconductor packages while simplifying manufacturing processes and meeting signal bandwidth and thermal dissipation requirements.
Implementation Method 1
enhance thermal conductivity and structural support
Implementation Method 2
provide support to the package. The interconnecting components may also include abilities to conduct thermal heat dissipation
Data Source
AI summary
A manufacturing method of a chip package, performing a coupling of first and second interconnecting layers between one or more top dies and one or more bottom dies via hybrid copper bonding; depositing a material to at least partially cover the second interconnecting layer; thinning a second surface of the one or more top dies, wherein both the one or more top dies and the material define a continuous surface; coupling a first surface of a support die to the second surface of at least one of the one or more top dies; thinning a second surface of at least one of the one or more bottom dies; and coupling the second surface of at least one of the one or more bottom dies to a plurality of microbumps.