Stacked Dual-SAW Acoustic Wave Device Footprint Reduction
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Solution Overview
Problem
The increasing demand for dual-surface acoustic wave (dual-SAW) or multi-surface acoustic wave (multi-SAW) devices in communication products poses a challenge due to the critical concern of footprint or circuit area occupied by these devices.
Innovation Solution
The acoustic wave device comprises two stacked SAW chips with electrodes and films, where the second chip is stacked on the first chip, reducing the circuit area by aligning the electrodes between the substrates and using films and side walls to protect and support the electrodes, with connections providing electrical and structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dual-SAW or multi-SAW devices are used to support increasing frequency bands, then signal coverage and roaming capability are improved, but the footprint and circuit area occupied by the devices increase
Solution Approach 1:
The patent transitions from a planar arrangement of SAW devices to a three-dimensional stacked configuration. Multiple SAW devices are vertically stacked with their electrodes arranged between substrates in different layers, enabling multiple frequency bands to be integrated within a compact vertical footprint while maintaining individual device functionality
Solution Approach 2:
The patent implements a nested structure where multiple SAW devices are integrated within a shared housing structure. The electrodes of different SAW devices are nested between the same pair of substrates, with insulating films separating them, allowing multiple devices to occupy overlapping spatial regions in different dimensional layers
2Area of stationary object
If electrodes are stacked between substrates to reduce footprint, then circuit area is reduced, but electrode stability and protection become critical concerns
Solution Approach 1:
The patent employs thin insulating films (such as silicon dioxide or silicon nitride) deposited between the substrates and electrodes. These films provide electrical insulation and mechanical protection to the stacked electrodes, preventing short circuits and physical damage while maintaining the compact three-dimensional structure
Solution Approach 2:
The patent incorporates insulating films and protective layers before final assembly to prevent electrode deformation and electrical interference. The housing structure is designed with precise positioning features that protect electrodes during assembly and operation, preventing mechanical stress and misalignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves miniaturization of the acoustic wave device while maintaining functionality, reducing the footprint and enhancing stability by protecting the electrodes and preventing deformation.
Implementation Method 1
a first film and a second film, wherein the first film is disposed between the first electrode and the second electrode
Implementation Method 2
Surface acoustic wave (SAW) devices may be used to convert and transmit electrical and acoustic signals
Data Source
AI summary
An acoustic wave device and a manufacture method thereof are provided. The acoustic wave device comprises a first substrate, a plurality of first electrodes, a second substrate, a plurality of second electrodes and a film. The first substrate comprises a first surface and a second surface. The plurality of first electrodes are disposed on the second surface of the first substrate. The second substrate comprises a third surface and a fourth surface. The plurality of second electrodes are disposed on the third surface of the second substrate. The second surface of the first substrate faces the third surface of the second substrate, such that the plurality of first electrodes and the plurality of second electrodes are arranged between the first substrate and the second substrate. The film is disposed between the plurality of first electrodes and the plurality of second electrodes.