Stacked Electronic Module Vertical Heat Conduction
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Solution Overview
Problem
Conventional electronic modules face challenges in achieving high heat dissipation when electronic elements are stacked, leading to heat confinement and reduced efficiency.
Innovation Solution
The electronic module design includes a first substrate with a conductor layer, a first electronic element, and a second electronic element stacked with a connecting body that has extending parts abutting against the substrate or conductor layer, enhancing heat dissipation by providing multiple extending and support parts that increase contact area and create space for heat release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic elements are stacked in a layer shape to miniaturize the electronic module, then the module size is reduced, but heat is easily confined and heat dissipation properties deteriorate
Solution Approach 1:
The connecting body extends in the height direction (vertical dimension) with multiple extending parts that reach toward the heat dissipation fin, creating a three-dimensional heat conduction path. This vertical extension allows heat to be conducted away from the stacked electronic elements through the height dimension, resolving the heat confinement issue while maintaining the compact stacked configuration.
Solution Approach 2:
The connecting body acts as an intermediary thermal conduction path between the electronic elements and the heat dissipation fin. It receives heat from the electronic elements through its head part and conducts it to the heat dissipation fin through its extending parts, effectively mediating the heat transfer process and preventing heat accumulation in the stacked configuration.
2Temperature
If a connecting body is provided to improve heat dissipation, then heat dissipation properties are improved, but the device structure becomes more complex
Solution Approach 1:
The connecting body serves multiple functions simultaneously: it provides mechanical support for the electronic elements, establishes electrical connections through its conductive material, and acts as a thermal conduction path to the heat dissipation fin. By integrating these multiple functions into a single component, the design improves heat dissipation without proportionally increasing structural complexity.
Solution Approach 2:
The connecting body merges the support function, electrical connection function, and thermal conduction function into a single integrated component. This consolidation reduces the number of separate parts needed and simplifies the overall structure while achieving effective heat dissipation from the stacked electronic elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration efficiently dissipates heat from the second electronic element, achieving high heat dissipation and preventing heat confinement, while allowing for a more balanced and stable module structure.
Implementation Method 1
an extending part extending from the second head part to the other side and abutting against the first substrate or the first conductor layer
Data Source
AI summary
An electronic module has a first substrate 11, a first conductor layer 12 that is provided on one side of the first substrate 11, a first electronic element 13 that is provided on one side of the first conductor layer 12, a second electronic element 23 that is provided on one side of the first electronic element 23, and a second connecting body 70 that has a second head part 71 provided on one side of the second electronic element 23 and an extending part 75 extending from the second head part 71 to the other side and abutting against the first substrate 11 or the first conductor layer 12.