Stacked Electronic Structure with Conductive Pillars
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Solution Overview
Problem
Conventional stacked electronic structures face challenges in reducing surface area occupation and impedance due to the use of outer conductive leads, which increases the overall size and impedance of compact electronic products.
Innovation Solution
A stacked electronic structure design featuring a substrate with electronic devices and conductive pillars, where a molding body encapsulates the devices and pillars, and a magnetic device is positioned over the pillars with electrodes connected to them, utilizing recesses and metal layers for improved connectivity and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If outer conductive leads are used to support the magnetic body in conventional stacked structures, then the magnetic body is structurally supported, but the surface area occupied increases and overall impedance increases
Solution Approach 1:
The patent extracts and eliminates the outer conductive leads from the conventional stacked structure. Instead of using leads extending outward from the substrate to support the magnetic body, the invention uses conductive pillars integrated directly into the substrate, removing the need for external lead structures and thereby reducing surface area occupation.
Solution Approach 2:
The patent transitions from a two-dimensional lead layout on the substrate surface to a three-dimensional vertical structure using conductive pillars. The magnetic body is supported vertically above the substrate through these pillars, changing the support mechanism from horizontal (leads on surface) to vertical (pillars through substrate), thus reducing surface area requirements.
2Strength
If outer conductive leads are used to support the magnetic body, then the magnetic body is structurally supported, but the overall impedance caused by the leads increases
Solution Approach 1:
The patent removes the outer conductive leads that cause impedance issues and replaces them with integrated conductive pillars. These pillars provide structural support without the impedance problems associated with external leads, as they are seamlessly integrated into the substrate's conductive network.
Solution Approach 2:
The conductive pillars serve as intermediaries between the substrate and the magnetic body, providing structural support while maintaining low impedance. These pillars act as direct conductive pathways, eliminating the need for external leads that would otherwise introduce impedance into the circuit.
3Area of stationary object
If conventional stacked structures are used, then electronic devices can be stacked to reduce footprint, but the use of outer leads increases surface area and impedance
Solution Approach 1:
The patent merges the structural support function and the electrical conduction function into a single integrated component - the conductive pillar. This eliminates the need for separate external leads, thereby reducing surface area occupation while simultaneously reducing impedance by providing direct, integrated conductive pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the surface area occupation and impedance by optimizing the placement and connectivity of electronic components, enhancing heat dissipation and reducing electromigration risks while maintaining efficient electrical connections.
Implementation Method 1
a soldering material is disposed on a top surface of the substrate and filled into said at least one first recess
Data Source
AI summary
A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.