Stacked IC Cooling via Discrete Fluidic Channels
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Solution Overview
Problem
Conventional cooling methods for integrated circuits (ICs), such as heat sinks and liquid cooling, are insufficient for effectively managing the high heat dissipation of ICs in stacked configurations like 3-D ICs, leading to elevated operating temperatures and reduced reliability and performance.
Innovation Solution
A two-phase cooling system with a structured arrangement of discrete connecting structures forming fluidic channels that facilitate directed flow boiling of a coolant, allowing efficient heat transfer from ICs in a stacked configuration, utilizing a primary and secondary cooling loop to manage thermal loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods (heat sinks and liquid cooling) are used for ICs in stacked configurations, then the cooling system is simple to implement, but the heat dissipation effectiveness is insufficient leading to elevated operating temperatures
Solution Approach 1:
The cooling system is segmented into multiple cooling loops (primary and secondary loops) with dedicated fluidic channels for each IC in the stack. Each cooling loop independently manages the thermal load of specific ICs, enabling precise temperature control for each component while maintaining overall system reliability.
Solution Approach 2:
The invention transitions from conventional single-phase liquid cooling to two-phase cooling with flow boiling. This phase change mechanism operates in a different thermal regime, providing dramatically enhanced heat transfer coefficients that can handle the high heat dissipation densities of stacked ICs while maintaining lower operating temperatures.
2Loss of energy
If two-phase cooling with directed flow boiling is implemented, then heat transfer efficiency is enhanced, but the device complexity increases with multiple cooling loops and structured connecting structures
Solution Approach 1:
The discrete connecting structures serve multiple functions simultaneously: they provide mechanical support between stacked ICs, create the boundaries of fluidic channels, and facilitate two-phase flow distribution. This multi-functionality reduces the need for separate cooling system components, thereby managing complexity while achieving enhanced heat transfer efficiency.
Solution Approach 2:
The structured arrangement of discrete connecting structures self-organizes to create the fluidic channel network. The connecting structures themselves form the channel boundaries, eliminating the need for separate channel fabrication processes and reducing manufacturing complexity despite the advanced cooling functionality.
3Productivity
If discrete connecting structures are arranged to create fluidic channels, then directed coolant flow is achieved improving heat transfer, but the manufacturing precision requirements increase
Solution Approach 1:
The fluidic channels are extracted and formed by the arrangement of discrete connecting structures rather than being fabricated as separate features. This approach leverages existing mechanical support structures to define the cooling channels, reducing the need for high-precision channel fabrication while maintaining effective directed flow for high productivity heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides enhanced heat transfer capabilities, maintaining low and uniform operating temperatures across ICs, thereby increasing reliability, performance, and computational capability while reducing energy expenditure for heat dissipation.
Implementation Method 1
transferring heat from the IC to the coolant by flow boiling the coolant in the fluidic channel
Implementation Method 2
flow boiling the coolant in the fluidic channel
Implementation Method 3
flow boiling the coolant
Implementation Method 4
condensing, in the condenser, the coolant from a vapor phase to a liquid phase
Implementation Method 5
pumping the coolant from the structure and into a condenser
Implementation Method 6
the first pump, the first pump having an outlet port coupled to the inlet port of the structure, the first pump configured to pump coolant through the structure
Data Source
AI summary
An integrated circuit (IC) can be cooled by using a structure that includes two elements, such as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the elements having surfaces that face each other. The structure also includes a pair of fluidic channel boundaries, between the facing surfaces, where each fluidic channel boundary is formed by an arrangement of adjacent discrete connecting structures. The primary and secondary fluidic channel boundaries and the facing surfaces define a fluidic channel that is useful for promoting boiling of and directing the flow of a refrigerant between the two surfaces.