Stacked Image Sensor Connection Detection for Signal Path Relief
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Solution Overview
Problem
The reliability and durability of connections between substrates in stacked image sensors are compromised due to potential connection failures, which affect the yield and functionality of the semiconductor devices.
Innovation Solution
A semiconductor device with a detection circuit on one substrate to monitor the connection state between substrates, allowing for the detection of connection failures and subsequent relief processing to maintain signal transmission integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If substrates are stacked to increase signal communication capacity, then data transfer amount between substrates is increased, but connection failure risk in substrate connection portion increases
Solution Approach 1:
The detection circuit performs preliminary detection of connection failures before they affect normal operation. By detecting connection states in advance through test signal transmission, the system can identify potential connection issues and switch to adjacent signal paths before actual signal transmission is impacted, thus maintaining reliability while enabling high-capacity data transfer through substrate stacking.
Solution Approach 2:
The detection circuit establishes a feedback mechanism that continuously monitors the connection state between substrates. When a connection failure is detected, the system receives feedback about the failed connection path and automatically switches to an adjacent signal path. This feedback loop ensures that the high data transfer capacity of stacked substrates is maintained while connection reliability is protected through real-time monitoring and automatic path switching.
2Reliability
If detection circuit is added to monitor connection state, then connection failure detection capability is improved, but device complexity increases
Solution Approach 1:
The detection circuit is merged with the existing substrate connection structure, sharing the same physical space and signal paths. The detection circuit utilizes the existing connection portions between substrates to transmit both test signals for detection purposes and actual data signals for operation, thereby improving connection failure detection capability without proportionally increasing device complexity through separate dedicated detection pathways.
Solution Approach 2:
The connection portions between substrates serve multiple functions: they transmit both test signals for connection state detection and actual data signals for normal operation. This multi-functionality allows the detection circuit to monitor connection reliability without requiring entirely separate dedicated detection pathways, thus improving detection capability while minimizing the increase in device complexity.
3Productivity
If connection failure detection and switching mechanism is implemented, then yield is improved, but manufacturing precision requirements increase
Solution Approach 1:
The detection circuit performs preliminary detection of connection failures before final product assembly and testing. By identifying connection issues early in the manufacturing process through test signal transmission, the system can flag defective units for rework or rejection before they proceed to later manufacturing stages, thereby improving overall yield without requiring extremely tight manufacturing precision tolerances.
Solution Approach 2:
The detection mechanism provides feedback about connection quality during manufacturing, allowing real-time adjustment and quality control. This feedback enables manufacturers to maintain higher yields by identifying and correcting connection issues during the manufacturing process itself, rather than discovering them later, thus reducing the need for excessively tight manufacturing precision requirements.
Data Source
AI summary
A semiconductor device in which a plurality of substrates including a first substrate and a second substrate are stacked, wherein the first substrate includes a pixel unit in which a plurality of pixels are arranged, the second substrate includes a control circuit configured to control the semiconductor device, and the first substrate further includes a detection circuit configured to detect a connection state of a connection portion between the first substrate and the second substrate.