Stacked Image Sensor Layers With Lens Bonding for Depth Sensing
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Solution Overview
Problem
Current image sensing devices face challenges in optimizing the stack structure for efficient light path correction and minimizing optical crosstalk, particularly in depth sensing applications where additional space is required for depth sensors, affecting design and performance.
Innovation Solution
The proposed image sensing device features two or more stacked image sensor layers with bonding layers, including lens structures that refract light to adjust the angle of incidence, and a digital lens with varying slit widths and a dielectric layer to optimize light transfer between layers, preventing optical crosstalk and enhancing light gathering efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If additional depth sensor layers are added to improve depth sensing capability, then depth measurement precision is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent transitions from planar 2D sensor arrangement to 3D stacked sensor layers, enabling multiple sensor types (color, depth, infrared) to be vertically integrated. This dimensional change allows depth sensing capability to be enhanced without increasing the device's footprint area, resolving the contradiction between measurement precision and device complexity.
Solution Approach 2:
The patent implements a nested structure where multiple sensor layers are stacked vertically with bonding layers connecting them. The depth sensor layer is nested within the overall stack structure, sharing the same physical space with color and infrared sensors. This nesting approach enables enhanced depth measurement precision while maintaining compact device dimensions and reducing overall structural complexity.
2Productivity
If lens structures are added to correct light path between layers, then light transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent modifies optical parameters by introducing lens structures with specific focal lengths and curvature radii between sensor layers. These lens parameters are optimized to refract light at specific angles, ensuring efficient light transfer from the color sensor layer to the depth sensor layer. This parameter optimization improves light transfer efficiency while keeping the optical structure relatively simple through precise parameter control rather than complex mechanical arrangements.
3Productivity
If slit widths are varied in the digital lens to optimize light transfer, then light gathering efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality variation by creating slits with different widths at different positions within the digital lens structure. The slit width is locally optimized based on the specific light path requirements for each region, allowing maximum light gathering efficiency. This local optimization approach enables precise control of light transfer while the overall structure remains manufacturable through standard semiconductor fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves light transfer efficiency, reduces optical crosstalk, and allows for the simultaneous acquisition of color and depth images, enhancing the overall performance and design flexibility of image sensing devices.
Implementation Method 1
a lens layer structured to refract light rays having passed through the first sensor layer toward the second sensor layer such that an angle of incidence of the light rays is larger than a refraction angle of the light rays
Implementation Method 2
a first sensor layer structured to include a plurality of first photoelectric conversion elements to receive light rays and generate photocharge corresponding to the light rays
Data Source
AI summary
Image sensing devices are disclosed. In some implementations, an image sensing device may include a first sensor layer structured to include a plurality of first photoelectric conversion elements to receive light rays and generate photocharge corresponding to the light rays, a second sensor layer disposed below the first sensor layer, the second sensor layer structured to include a plurality of second photoelectric conversion element vertically overlapping the first photoelectric conversion elements to receive light rays and generate photocharge corresponding to the light rays having passed through the first sensor layer, and a bonding layer disposed between the first and second sensor layers, wherein the bonding layer comprises a lens layer structured to refract light rays having passed through the first sensor layer toward the second sensor layer such that an angle of incidence of the light rays is larger than a refraction angle of the light rays.