Stacked Image Sensor Substrate Bonding and Via Interconnect
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Solution Overview
Problem
Current image sensing apparatus manufacturing methods face challenges in efficiently integrating pixel regions with photoelectric conversion elements and circuit regions, leading to complexities in bonding and connection processes, which affect the compactness and processing speed of image sensing units.
Innovation Solution
A method involving the formation of a stack structure with a first substrate structure containing a pixel region and a second substrate structure with a circuit region, bonded such that the pixel region is connected through a connection via, and semiconductor chips are mounted using conductive bumps, allowing for the separation of unit image sensing apparatuses with improved connectivity and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pixel regions and circuit regions are integrated on separate substrates requiring bonding, then connectivity between regions is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The apparatus is divided into a first substrate containing the pixel region and a second substrate containing the circuit region. These separate substrates are bonded together through connection vias, allowing each substrate to be optimized independently while maintaining reliable electrical connectivity between the pixel and circuit regions.
Solution Approach 2:
Connection vias serve as intermediary structures that bridge the first substrate and second substrate. These vias provide the electrical connection pathway between the pixel region on the first substrate and the circuit region on the second substrate, enabling reliable signal transmission across the substrate interface.
2Speed
If multiple substrates are bonded together to integrate pixel and circuit regions, then image processing speed is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The first substrate and second substrate are prepared with pre-formed connection vias and bonding interfaces before the bonding process. This preliminary preparation ensures that when the substrates are bonded together, the alignment and connection accuracy are maintained, reducing the stringency of precision requirements during the actual bonding operation.
3Reliability
If semiconductor chips are mounted using conductive bumps on bonded substrates, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The mounting of semiconductor chips using conductive bumps is integrated with the existing substrate bonding process. The conductive bumps serve dual functions: providing mechanical attachment for the chips and establishing electrical connections to the circuit region on the second substrate. This merging of functions reduces overall device complexity despite the addition of chip mounting.
Data Source
AI summary
A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.