Stacked Solid-State Imaging Device Substrate Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing solid-state imaging devices face challenges in efficiently connecting multiple substrates for simultaneous signal processing and storage, leading to limitations in image capture and processing capabilities.
Innovation Solution
A solid-state imaging device configuration with multiple substrates, where each substrate has specific layers and components, including photoelectric conversion elements, through electrodes, and microbumps, allowing for efficient electrical connections and signal processing across substrates, enabling simultaneous shutter operation and improved image capture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are connected using through electrodes and microbumps for simultaneous signal processing and storage, then the image capture and processing capabilities are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The imaging device is divided into multiple substrates (first substrate with photoelectric conversion elements, second substrate with memory circuits, third substrate with processing circuits) that are stacked and connected. This segmentation allows simultaneous signal processing and storage while distributing complexity across separate functional modules, resolving the contradiction between improved capabilities and device complexity.
Solution Approach 2:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration, connecting substrates in the vertical dimension through through electrodes and microbumps. This dimensional change enables simultaneous signal processing and storage without increasing lateral device footprint, improving productivity while managing complexity through vertical integration.
2Productivity
If through electrodes are used to connect substrates for signal transmission, then the signal processing capability is improved, but the influence on circuit characteristics and manufacturing precision requirements increase
Solution Approach 1:
Microbumps are introduced as intermediary connection elements between the through electrodes on different substrates. These microbumps serve as mediators that facilitate electrical connection while providing tolerance for alignment variations, thereby reducing the stringent manufacturing precision requirements while maintaining improved signal processing capability.
Solution Approach 2:
The patent employs multiple connection methods (through electrodes, microbumps, pads) with different electrical and mechanical characteristics. By changing connection parameters and using heterogeneous connection structures, the system achieves robust signal transmission while relaxing precision constraints compared to single-point rigid connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the device's ability to process and store signals effectively, reducing the influence of through electrodes on circuit characteristics and improving overall image capture and processing efficiency.
Implementation Method 1
The first substrate has a plurality of first photoelectric conversion elements
Data Source
AI summary
A solid-state imaging device has a first substrate, a second substrate, and a third substrate. The first substrate has a plurality of first photoelectric conversion elements. The second substrate has a plurality of first through electrodes. The plurality of first photoelectric conversion elements are disposed in a pixel area. The plurality of first through electrodes are disposed only in a second area around a first area corresponding to the pixel area.