Stacked LED Display Panel Vias for Reliable Sub-Pixel Connections
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Solution Overview
Problem
Existing LED display technologies face challenges in achieving reliable electrical connections between LEDs and circuit boards, particularly with small-sized LEDs, which are difficult to handle and mount individually. Additionally, the transfer of multiple LEDs in groups can result in electrical disconnects due to thermal expansion coefficient differences between the circuit board and the support substrate.
Innovation Solution
The proposed solution involves an LED display panel with a circuit board having pads for electrical connection, where each pixel region includes multiple LED stacks with bonding layers and through-vias connected to the pads. This configuration eliminates the need for transferring individual LEDs to the circuit board and allows for independent driving of each LED stack, enhancing reliability and brightness by optimizing sub-pixel area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If small-sized LEDs are transferred in groups from a support substrate to a circuit board, then productivity is improved, but reliability deteriorates due to electrical disconnects caused by thermal expansion coefficient differences
Solution Approach 1:
The patent divides the LED structure into vertically stacked sub-pixels (first, second, and third LED stacks) rather than transferring individual planar LEDs. This segmentation allows each stack to be independently mounted onto the circuit board, ensuring reliable electrical connections while maintaining high productivity.
Solution Approach 2:
The patent transitions from a two-dimensional planar LED arrangement to a three-dimensional vertical stack configuration. Multiple LED stacks are arranged in the vertical dimension, allowing increased sub-pixel area within the same pixel region while improving electrical connection reliability through direct mounting on the circuit board.
2Device complexity
If sub-pixels are arranged on a two-dimensional plane, then device complexity is reduced, but area of each sub-pixel is limited which restricts brightness
Solution Approach 1:
The patent introduces a vertical dimension by stacking multiple LED structures (first LED stack, second LED stack, third LED stack) one above another. This three-dimensional arrangement significantly increases the total light-emitting area within each pixel region while maintaining relatively simple structural organization through standardized bonding layers and through-vias.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides reliable electrical connections between LEDs and the circuit board, prevents issues related to thermal expansion, and increases the area of each sub-pixel, thereby enhancing the brightness and reliability of the LED display panel.
Implementation Method 1
a first bonding layer disposed between the first LED stack and the circuit board
Implementation Method 2
first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board
Data Source
AI summary
A display panel including a circuit board having pads thereon, and a plurality of pixel regions arranged on the circuit board, each of the pixel regions including a first LED stack disposed on the circuit board, a first bonding layer disposed between the first LED stack and the circuit board, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board.