Stacked LED Substrate Assembly for Narrow-Bezel High-Brightness Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The traditional stent-type LED light source assembly for electronic devices, such as mobile phones and tablets, faces challenges in miniaturization, integration, and high brightness due to large size and complexity in manufacturing, leading to increased costs and difficulty in meeting brightness demands.
Innovation Solution
A substrate assembly with stacked first and second substrates, featuring gold-plated conductive regions and members, allows for direct LED chip placement and connection, eliminating the need for stents, thereby reducing manufacturing complexity and cost while improving brightness and color mixing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional stent-type LED light source assembly is used, then LED chip can be supported and connected, but the assembly size becomes large and manufacturing complexity increases
Solution Approach 1:
The patent removes the stent component from the LED light source assembly, integrating the LED chip directly onto the circuit board. This extraction of the stent eliminates the need for separate support structures and reduces overall assembly complexity while maintaining LED chip support functionality through direct mounting.
Solution Approach 2:
The patent merges the stent support function with the circuit board structure by directly mounting LED chips onto the circuit board. This consolidation eliminates the need for separate stent components and reduces the number of parts in the assembly, thereby simplifying the overall structure.
2Reliability
If traditional stent-type LED light source assembly is used, then LED chip can be supported, but manufacturing cost increases
Solution Approach 1:
By removing the stent component, the patent reduces the number of parts that need to be manufactured, assembled, and quality-checked. This extraction simplifies the manufacturing process and reduces costs associated with stent production and assembly operations.
Solution Approach 2:
The integration of LED chip directly onto the circuit board merges two separate manufacturing processes into one, reducing assembly steps and lowering manufacturing costs while maintaining the necessary support and electrical connection functions.
3Area of stationary object
If LED chips are placed closer together to reduce bezel width, then display area increases, but short circuit between adjacent LEDs occurs
Solution Approach 1:
By removing the stent structure that previously occupied space between LED chips, the patent enables closer spacing of LEDs without the risk of solder bridging. The direct mounting approach eliminates the physical barrier that stents created, allowing for reduced pitch while maintaining electrical isolation through proper PCB design.
4Length of stationary object
If stent structure is reduced to minimize assembly size, then bezel width decreases, but LED chip size must be reduced thus reducing brightness
Solution Approach 1:
By eliminating the stent structure, the patent removes the constraint that forced a trade-off between assembly size and LED chip size. The direct mounting approach allows larger LED chips to be used in smaller bezel configurations, maintaining or even improving brightness while reducing overall assembly dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more compact LED light source assembly with improved brightness and color mixing, reduced bezel width, and lower manufacturing costs by allowing closer spacing of LED chips without short circuits, enhancing the display effect.
Implementation Method 1
forming at least two electrode soldering regions and at least two corresponding first conductive regions respectively on a front side and a back side of a first substrate through a gold plating process
Data Source
AI summary
The present application relates to a substrate, an LED light source assembly and manufacturing methods therefor. The substrate includes a first substrate and a second substrate which are arranged in a stacked manner. Electrode soldering regions on the front side of the first substrate and corresponding first conductive regions on the back side of the first substrate are electrically connected; and second conductive regions on the front side of the second substrate and corresponding third conductive regions on the back side of the second substrate are electrically connected, where the corresponding first conductive regions and the corresponding second conductive regions are electrically connected.