Stacked Light Emitting Device Red Area Optimization
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Solution Overview
Problem
Conventional light emitting devices face challenges in achieving balanced color output and light efficiency, particularly in micro LED displays where red light emitting parts often have lower efficiency compared to blue and green parts, leading to imbalanced color rendering and reduced overall efficiency.
Innovation Solution
The design involves stacking light emitting parts with varying areas, where the red light emitting part has a larger area than blue and green parts, and includes a specific semiconductor structure and adhesion layers to enhance light extraction and electrical coupling, ensuring balanced color output and improved light efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the area of red light emitting part is increased to match blue and green parts, then color balance is improved, but device area and complexity increase
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration. The red light emitting part is positioned on a second substrate that is stacked over the first substrate containing blue and green light emitting parts. This vertical stacking enables the red part to have a larger effective area without increasing the device's footprint, resolving the contradiction between color balance and device area.
Solution Approach 2:
The patent implements a nested structure where the red light emitting part is integrated into a stacked configuration with blue and green light emitting parts. The adhesion layer structure creates a nested arrangement that allows the red part to be coupled to both substrates, enabling larger area coverage within a compact form factor.
2Ease of manufacture
If conventional planar structure is used, then manufacturing is simpler, but light extraction efficiency is reduced
Solution Approach 1:
The patent introduces a three-dimensional stacked structure with adhesion layers that enable light extraction from multiple directions. The adhesion layer configuration creates optical pathways that extract light more efficiently compared to conventional planar structures, while still using standard semiconductor manufacturing processes.
Solution Approach 2:
The adhesion layer serves as an intermediary structure that facilitates both mechanical bonding and optical functions. It enables light extraction enhancement without requiring complex manufacturing processes, acting as a mediator between the light emitting parts and the substrates.
3Productivity
If red light emitting part has larger area, then light efficiency is improved, but electrical coupling complexity increases
Solution Approach 1:
The patent uses a nested adhesion layer structure where the first adhesion layer couples the red light emitting part to the first substrate, and the second adhesion layer couples it to the second substrate. This nested configuration provides multiple electrical coupling pathways, simplifying the electrical connection process despite the larger area of the red light emitting part.
Solution Approach 2:
The adhesion layers serve multiple functions simultaneously: mechanical bonding, electrical coupling, and optical extraction enhancement. This multi-functionality reduces the need for separate components and simplifies the overall electrical coupling structure, enabling high light efficiency without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light efficiency and color balance by increasing the area of the red light emitting part, thereby achieving comparable light emission across different colors, improving the overall performance of the light emitting device.
Implementation Method 1
Light emitting diodes, as inorganic light sources, are being diversely used in various fields
Implementation Method 2
an adhesion part disposed between the first and second light emitting parts and the third light emitting part, between the first and second semiconductor structures, and bonding the first and second light emitting parts and the third light emitting part
Data Source
AI summary
A light emitting device including a first light emitting part having a first area, a second light emitting part having a second area, and a third light emitting part having a third area, in which the first light emitting part is disposed on the same plane as the second light emitting part, the third light emitting part is disposed over the first and second light emitting parts, and the third area is larger than each of the first and second areas.