On-Chip Power Initialization for Stacked Semiconductor Memory
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Solution Overview
Problem
In semiconductor memory devices with stacked chips, existing methods for setting signal transmission power are inefficient, requiring long setup times and being prone to errors due to variations in signal communication distance and environmental changes, especially when using wireless signal transmission between chips.
Innovation Solution
A power initializing method that involves generating a test signal with an initial high power value, checking for errors, and progressively reducing power until the signal is deemed acceptable, then using this optimized power setting for subsequent chips in the stack, allowing for on-chip automatic adjustment to environmental changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same signal transmission power is provided to all semiconductor chips in a stack, then the manufacturing process is simplified, but signal transmission errors occur due to different communication distances
Solution Approach 1:
The patent applies local quality by setting different signal transmission powers for different chips based on their specific communication distances. Each chip receives a customized power level tailored to its position in the stack, ensuring optimal signal quality without requiring complex manufacturing adjustments.
Solution Approach 2:
The patent changes the power parameter of signal transmission dynamically based on the communication distance to each chip. By adjusting this parameter according to position, the system achieves both manufacturing simplicity and transmission reliability.
2Reliability
If conventional power setting methods are used for each chip, then signal transmission can be maintained, but the power initialization time is excessively long
Solution Approach 1:
The patent performs preliminary action by pre-determining the communication distances between the controller chip and other chips during manufacturing. This advance preparation allows for rapid power initialization without time-consuming adjustments during operation.
Solution Approach 2:
The patent implements a dynamic power initialization method that automatically adjusts transmission powers based on pre-stored distance information. This dynamic approach replaces conventional static, time-consuming power setting procedures.
3Ease of operation
If fixed signal transmission power is used, then the system is simple to operate, but the system cannot adapt to environmental variations and signal errors increase
Solution Approach 1:
The patent enables self-service by implementing an automatic power adjustment mechanism that uses pre-stored distance information to dynamically control transmission powers. The system self-adjusts without requiring manual intervention, maintaining both operational simplicity and environmental adaptability.
Solution Approach 2:
The patent incorporates feedback mechanisms that monitor signal transmission quality and automatically adjust power levels based on pre-determined distance parameters, allowing the system to adapt to environmental variations while maintaining ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method optimizes signal transmission power, reduces unnecessary power consumption, and shortens the power initialization time by sequentially setting power values for each chip, ensuring reliable signal transmission while adapting to environmental variations.
Implementation Method 1
the signal can be transmitted according to a capacitive coupling or inductive coupling method
Implementation Method 2
the signal can be transmitted according to a capacitive coupling or inductive coupling method
Data Source
AI summary
A semiconductor memory device can automatically control signal transmission power on-chip based on a wireless signal transmission. The semiconductor memory device can have a multi-chip stack structure. A power initializing method of the semiconductor memory device can comprise providing a test signal generated by a signal-providing chip to a first chip, checking whether the test signal provided to the first chip has an error, providing the checking result to the signal-providing chip, setting the power of a first signal provided to the first chip according to the checking result, and setting the power of a signal provided to a second chip adjacent to the first chip and close to the signal-providing chip using the power of the first signal.